Conductive Film PVD Sputtering System, Ceramic PVD Copper Sputtering Vacuum Deposition Machine ,

Au Gold Sputtering Deposition Equipment, Silve/Gold PVD Deposition Machine, Conductive Film PVD Sputtering System 

Summary: The DPC process- Direct Plating Copper is an advanced coating technology applied with LED / semiconductor / electronic industries. One typical application is Ceramic Radiating Substrate. Cooper conductive film deposition on Aluminum Oxide (Al2O3), AlN substrates by PVD vacuum sputtering technology, compared with traditional manufacturing

methods: DBC LTCC HTCC, much lower production cost is its high feature.

Royal technology team assisted our customer to developed the DPC process successfully with PVD sputtering technology.

Keywords: Ceramic sealing parts, DPC process, Copper PVD Sputtering system, LED Ceramic Chips With Cooper Plating, Al₂O₃, AlN Ceramic Circuit Boards, Al2O3 Plates On LED, Semiconductor

Applications of DPC:

· HBLED

· Substrates for solar concentrator cells

· Power semiconductor packaging including automotive motor control

· Hybrid and electric automobile power management electronics

· Packages for RF

· Microwave devices

DPC Technology Performance

       Various substrate materials: Ceramic (Al3O2, AlN), Glass, and Si

• Much lower production cost.
• Outstanding thermal management and heat-transfer performance
• Accurate alignment and pattern design
• Robust metallization adhesion

Features:

• High throughput up to 2.2 ㎡ Ceramic substrate per cycle;
• Strong adhesion with powerful heating-up device and plasma source cleaning;
• Compact design and with easy access for upgrading and maintenance work.
• Fully Automation, PLC+Touch Screen, one-touch control system.
• High efficiency with less power consumption, max. 50% production cost saving.

Technical Specifications

• Performance

1. Ultimate Vacuum Pressure: better than 9.0*10^-5 Pa;

• Base Vacuum pressure: 3.0*10^-2 Pa

3. Pumping down Time: from atm to 1.0×10^-3 Pa≤15 minutes ( room temperature, dry, clean and empty chamber)

4. Deposition source: Gencoa magnetron sputtering cathodes, steered arc cathodes, Ion source

5. Operating Model: Full Automatically /Semi-Auto/ Manually

6. Heating: from room temperature up to max. 500℃,

9. Ion source for PECVD and PA PVD process.

• Structure

The vacuum coating machine contains key completed system listed below:

1. Vacuum Chamber

1.1 Size: Inner Diameter: 1200mm

Inner Height: 1500mm

1.2 Material: Vacuum Chamber SUS304

Door and flanges SUS304

Chamber strengthen structure: SS41 mild steel, with painted finishing surface treatment.

Chamber chassis SS41 mild steel with painted finishing surface treatment.

1.3 Chamber Shield : SUS304

1.4 View Window: 2 on door

1.5 Vacuum Chamber Venting Valve (including silencer)

1.6 Door: SUS304 material

2. Roughing Vacuum Pumping System:

Oil rotary vane vacuum pump + Holding Pump
 

3. High Vacuum Pumping System:  Magnetically Suspension Molecular Pump - 2 sets

4. Electrical Control and Operation System- PLC+ Touch Screen Operation System:

Suppliers:

PLC: Mitsubishi + Touch Screen (Made in China)

Electronic Components: SCHNEIDER,OMRON.

Safety Protecting System: Numerous safety interlocks to protect operators and equipment ( water, current gas, temperature etc.)

Coating Processes System: Process Automation & Control.

4.1 Main circuit: None-fuse breaker switch, electromagnetic switch, C/T in series type

4.2 Power Supply: DC/MF sputtering power + DC Arc power + Bias Power Supply

4.3 Deposition control system

4.4 Operation System: Touch Screen + PLC, recipe control and data logging, Auto shutdown, auto evacuation, auto coating

4.5 Measuring System

Vacuum Pressure : Vacuum Gauge: Pirani + Penning gauge + Full range vacuum gauge -- Europe brand

Temperature measuring device: Thermo-couple
MFC: Mass Flow Controller ( 4 ways ),

4.6 Alarm System: Compressed air pressure , Cooling water flow, Mis-operation

4.7 Power Load Indicator: Voltage indicator and load current indicator

5. Deposition System

5.1 Deposition source: Sputtering cathodes+ Arc sources + Ion Source

5.2 Deposition material: Copper, Aluminum, Chrome, Silver, Gold, SS, Titanium etc.
 

6. Sub-System

6.1 Air Compressed Valve Control System

6.2 Cooling Water System:Water flow pipe and switch valve system

7. Working Environment

Compressed Air: 5~8kg/cm2

Cooling Water: Water-In Temperature: 20~25℃, 200 Liter/min,
Water-In Pressure: 2~3 kg/cm2,

Power: 3 Phase 380V 50Hz(60Hz), 130kVA, average power consumption: 60KW

Installation Area: (L*W*H)4400*3200*2950mm

         Exhaust: Vent for mechanical pumps

Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.