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DC Magnetron Sputtering Coating Machine , Unbalanced Planar Sputtering Coating System

1 set
MOQ
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Price
DC Magnetron Sputtering Coating Machine ,  Unbalanced Planar Sputtering Coating System
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Features
Specifications
Chamber: Vertical Orientation, 2-doors
Material: Stainless Steel 304/316
Deposition Sources: DC Sputtering Cathode
Technique: PVD, Balanced/Unbalanced Magentron Sputtering Cathode
Applications: Decorations Of Jewelry, Watch, Conductive Film Coating, Metal Film, Electronics, Fuel Cell, Physics Energy, Auto Industries
Film Features: Wear Resistance, Strong Adhesion, Decorative Coating Colors
Factory Location: Shanghai City, China
Worldwide Service: Poland - Europe; Iran- West Asia & Middle East, Turkey, India, Mexico- South America
Training Service: Machine Operation, Maintenance, Coating Process Recipes, Program
Warranty: Limited Warranty 1 Year For Free, Whole Life For Machine
OEM & ODM: Available, We Support Tailor Made Design And Fabrication
High Light:

magnetron sputtering equipment

,

vacuum deposition equipment

Basic Infomation
Place of Origin: Made in China
Brand Name: ROYAL
Certification: CE certification
Model Number: RTSP1200
Payment & Shipping Terms
Packaging Details: Export standard, to be packed in new cases/cartons, suitable for long-distance ocean/air and inland transportation.
Delivery Time: 12 weeks
Payment Terms: L/C, T/T
Supply Ability: 6 sets per month
Product Description

 

 

DC Magnetron Sputtering Coating Machine / DC Sputtering System

 

Magnetron Sputtering Models:   DC Sputtering, MF Sputtering, RF Sputtering 

 

What is DC  Sputtering?

 

DC Sputtering mainly used to sputter pure metal targets like: Chrome, Titanium, Aluminum, Copper, Stainless Steel, Nickle, Silver, Gold for high conductive films. 

 

DC  Sputtering is a Thin Film Physical Vapor Deposition (PVD) Coating technique where a target material to be used as the coating is bombarded with ionized gas molecules causing atoms to be “Sputtered” off into the plasma. These vaporized atoms are then deposited when they condense as a thin film on the substrate to be coated.

 

DC Sputtering is the most basic and inexpensive type of sputtering for PVD metal deposition and electrically conductive target coating materials. Two major advantages of DC as a power source for this process is that it is easy to control and is a low cost option if you are doing metal deposition for coating.

DC Sputtering is used extensively in the semiconductor industry creating microchip circuitry on the molecular level. It is used for gold sputter coatings of jewelry, watches and other decorative finishes, for non-reflective coatings on glass and optical components, as well as for metalized packaging plastics, car mirrors, car lighting reflectors, car wheel and hubs etc. 

 

DC  Magnetron Sputtering Coating Machine  Performance

1. Ultimate Vacuum Pressure: better than 5.0×10-6 Torr.

2. Operating Vacuum Pressure: 1.0×10-4 Torr.

3. Pumpingdown Time: from 1 atm to 1.0×10-4 Torr≤ 3 minutes ( room temperature, dry, clean and empty chamber)

4. Metalizing material (sputtering + Arc evaporation): Ni, Cu, Ag, Au, Ti, Zr, Cr, TiN, TiC, TiAlN, CrN, CrC, etc.

5. Operating Model: Full Automatically /Semi-Auto/ Manually

 

DC  Magnetron Sputtering Coating Machine  Structure

The vacuum coating machine contains key completed system listed below:

1. Vacuum Chamber

2. Rouhging Vacuum Pumping System (Backing Pump Package)

3. High Vacuum Pumping System ( Magnetically Suspension Molecular Pump)

4. Electrical Control and Operation System

5. Auxiliarry Facility System (Sub System)

6. Deposition System: DC  sputtering cathode, DC  power supply, Bias Power Supply Ion source for optional

 

DC  Magnetron Sputtering Coating Machine  Specifications 

RTSP1250-DC
MODEL  RTSP1250-DC
TECHNOLOGY Magnetron Sputtering (DC) + Ion Plating
MATERIAL Stainless Steel (S304)
CHAMBER SIZE Φ1250*H1250mm
CHAMBER TYPE Cylinder, vertical, 1-door
SPUTTERING SYSTEM Exclusively design for thin black film deposition
DEPOSITION MATERIAL Aluminum, Silver, Copper, Chrome, Stainless Steel, Nickel, Titanium
DEPOSITION SOURCE  Cylindrical / Planar Sputtering Targets +  7 Steered Cathodic Arc Sources
GAS MFC- 4 ways, Ar, N2, O2, C2H2
CONTROL PLC(Programmable Logic Controller) +
Touch Screen
PUMP SYSTEM SV300B - 1 set (Leybold)
WAU1001 - 1 sets (Leybold)
D60T- 2sets (Leybold)
Turbo Molecular Pumps: 2* F-400/3500
PRE-TREATMENT Bias power supply: 1*36 KW
SAFETY SYSTEM Numerous safety interlocks to protect operators
and equipment
COOLING Cold Water
POWER ELECTRICAL 480V/3 phases/60HZ ( USA compliant)
460V/3 phases/50HZ ( Asia compliant)
380V/3 phases/50HZ ( EU-CE compliant)
FOOTPRINT L3000*W3000*H2000mm
TOTAL WEIGHT 7.0 T
FOOTPRINT ( L*W*H) 5000*4000 *4000 MM
CYCLE TIME 30~40 minutes (depending on substrate material,
substrate geometry and environmental conditions)
POWER MAX.. 155KW
AVERAGE POWER CONSUMPTION (APPROX.) 75KW

 

We have more models for your selection! 

DC Magnetron Sputtering Coating Machine ,  Unbalanced Planar Sputtering Coating System 0

 

Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.

 

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