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DC And MF Magnetron Sputtering Coating Machine Deep Black PVD Coating Solutions

1 set
MOQ
negotiable
Price
DC And MF Magnetron Sputtering Coating Machine Deep Black PVD Coating Solutions
Features Gallery Product Description Request A Quote
Features
Specifications
Coating Technology: Sputtering, Evaporation, Plasma Treater
Equipment Features: Robust Structure, Compact Footprint Design, High Efficiency And Precision Oepration Control
Coating Application: Electronic Paper, ITO Film, Flexible Circuits, Photovoltaic, Medical Strips And RFID.
Operation Control: Intuitive PLC And IPC Control
Service And Training: Available, From The USA Engineer And Technicians
Name: Thin Film Coating Machine
Factory Location: Shanghai City, China
Worldwide Service: Poland - Europe; Iran- West Asia & Middle East, Turkey, India, Mexico- South America
Training Service: Machine Operation, Maintenance, Coating Process Recipes, Program
Warranty: Limited Warranty 1 Year For Free, Whole Life For Machine
OEM & ODM: Available, We Support Tailor Made Design And Fabrication
High Light:

DC Magnetron Sputtering Coating Machine

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MF Magnetron Sputtering Coating Machine

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Magnetron PVD Coating Machine

Basic Infomation
Place of Origin: Made in China
Brand Name: ROYAL
Certification: CE
Model Number: RTAS1250
Payment & Shipping Terms
Packaging Details: Export standard, to be packed in new cases/cartons, suitable for long-distance ocean/air and inland transportation.
Delivery Time: 24 weeks
Payment Terms: L/C, D/A, D/P, T/T
Supply Ability: 2 sets per month
Product Description

   

DC and MF Magnetron Sputtering Coating Machine, Deep Black PVD Coating Solutions

 

 

Magnetron Sputtering Coating

 

Plasma coating
Magnetron sputtering is a plasma coating process whereby sputtering material is ejected due to bombardment of ions to the target surface. The vacuum chamber of the PVD coating machine is filled with an inert gas, such as argon. By applying a high voltage, a glow discharge is created, resulting in acceleration of ions to the target surface and a plasma coating. The argon-ions will eject sputtering materials from the target surface (sputtering), resulting in a sputtered coating layer on the products in front of the target.
Magnetron sputtering technology is characterized by:

  • A water-cooled target, so little radiation heat is generated
  • Almost any metallic target material can be sputtered without decomposition
  • Non-conductive materials can be sputtered by using radio frequency (RF)
    or medium frequency (MF) power
  • Oxide coatings can be sputtered (reactive sputtering)
  • Excellent layer uniformity
  • Very smooth sputtered coatings (no droplets)
  • Cathodes (of up to 2 meter long) can be put in any position, therefore high
    flexibility of sputtering equipment design
  •  
MODEL RTAC1250-SPMF
TECHNOLOGY MF Magnetron Sputtering + Ion Plating
MATERIAL Stainless Steel (S304)
CHAMBER SIZE Φ1250 * H1250mm
CHAMBER TYPE Cylinder, vertical, 1-door
SPUTTERING SYSTEM Exclusively design for thin black film deposition
DEPOSITION MATERIAL Aluminum, Silver, Copper, Chrome, Stainless Steel,
Nickel
DEPOSITION SOURCE 2 sets MF Cylindrical Sputtering Targets + 8 Steered Cathodic Arc Sources + Ion Source For optional
GAS MFC- 4 ways, Ar, N2, O2, C2H2
CONTROL PLC(Programmable Logic Controller) +
PUMP SYSTEM SV300B - 1 set (Leybold)
WAU1001 - 1 sets (Leybold)
D60T- 1 set (Leybold)
Turbo Molecular Pumps: 2* F-400/3500
PRE-TREATMENT Bias power supply: 1*36 KW
SAFETY SYSTEM Numerous safety interlocks to protect operators
COOLING Cold Water
POWER ELECTRICAL 480V/3 phases/60HZ ( USA compliant)
460V/3 phases/50HZ ( Asia compliant)
380V/3 phases/50HZ ( EU-CE compliant)
FOOTPRINT L3000*W3000*H2000mm
TOTAL WEIGHT 7.0 T
FOOTPRINT ( L*W*H) 5000*4000 *4000 MM
CYCLE TIME 30~40 minutes (depending on substrate material,
substrate geometry and environmental conditions)
POWER MAX.. 155 KW
AVERAGE POWER
CONSUMPTION (APPROX.)
75 KW

 

 

Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.

 

 

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