Closed field unbalanced magnetron sputtering deposition system, Unbalanced Magnetron Sputtering Ion Plating
Unbalanced and closed field magnetron processes have all the advantages of planar magnetrons. Additional advantages and disadvantages are:
Additional ion bombardment resulting in dense, adherent films
Ion assist and substrate cleaning possible
Improved tribological, wear and corrosion resistant films
Amenable to multilayer, superlattice, nanolaminant and nanocomposite films
Poorer materials usage
More complex cathode configuration/expense
Unbalanced and closed field magnetron sputtering revolutionized properties achievable by magnetron sputtering processes. As successful with improved thin film tribological, corrosion resistance and optical properties as this technology was, improvements in magnetron technology had just begun. Next Blog we move onto rotating and cylindrical magnetron processes and resulting thin film applications.
--- Above Artical from P E T E R M A R T I N
Royal technology developed high yield and high target utilization sputtering cathodes, especially for rare and expensive metals sputtering: Au Gold, Ta Tantalum, Ag silver metal films deposition. The high uniformity film's deposition system have been serving several industries like Electronics parts, medical instruments components which require high film uniformity, multiple layers deposition.
The RTSP1000 machine is a standardized machine developed by Royal technology. Extensive applied with cutting/forming tools, molds, medical instruments, electronics components, automotive industries.
RTSP1000 Main Configurations and Technical Parameters
MF magnetron sputtering + ion source plasma cleaning
Stainless Steel (S304)
ROTATION RACK & JIG SYSTEM
6 satellites Max. weight: 500kgs
Qty. of Sputtering: 2*24 KW Bias of Power Supply: 1*20W Ion Source Power supply 1*5KW
Ti/Cr/TiAl /Ta/Cu/Au/Carbon etc.
2 pairs (4 pieces) Planar Sputtering Cathodes +
1 Linear Ion Source
Uniformity Area: ±10~15%