RT1200-DPC - China- Direct Plating Copper on Ceramic/AlN chips, LED lighting

                          The first machine on DPC application in China

Background and Project Introduction:

1. In Aug. 2016, we received customer inquiry and started coating process’s R&D

2. In April 2017, the machine was installed in customer site successfully.

3. In 2018, we improved design and structures, DPC1215+ model, 2 sets delivered to customer in the end of 2018

Machine Model: RT1200-DPC

Technology: PVD+PECVD

Location: China

Application: Ceramic (Al3O2, AlN), Glass, and Si substrates,

• HBLED
• ·Substrates for solar concentrator cells
• ·Power semiconductor packaging including automotive motor control
• ·Hybrid and electric automobile power management electronics
• ·Packages for RF
• ·Microwave devices

Royal technology team collaborated with our customer to developed the DPC process successfully with PVD sputtering technology since year of 2016.

The DPC process- Direct Plating Copper is an advanced coating technology applied with LED, semiconductor, electronic industries. One typical application is Ceramic Radiating Substrate. Cooper conductive film deposition on Aluminum Oxide (Al2O3), AlN substrates by PVD vacuum sputtering technology, compared with traditional manufacturing methods: DBC LTCC HTCC, much lower production cost is its high feature.

Please contact us if you want to learn more for the technology and machine.