Flexible, Stable, Standardized, High Quality And Repeatable
magnetron sputtering machine
vacuum deposition equipment
Ni PVD Sputtering Coating Plant, Cr Vacuum Metallizing System, Sn /Ag Vacuum Plating Equipment , Copper Plating Plant
The RTAC1215-SP machine is an octcal type, which consisting of vacuum pumps, vacuum chamber which mounted 8 arc cathodes, 1 linear ion source, 2 sets of DC sputtering cathodes and 1 pair of MF sputtering cathodes. The ion source, sputtering cathodes mounted flanges are standized which can be exchanged flexiblely based on actually coating process's demand.
1. DPC industry for Ceramic sealing parts, DPC process, Copper PVD Sputtering system, LED Ceramic Chips With Cooper Plating, Al2O3, AlN Ceramic Circuit Boards, Al2O3 Plates On LED, Semiconductor
2. Silver, Ni, Chrome, Gold, Aluminum, In, Sn etc. metal films and TiN, TiAlN, TiC, TiO, CrC, CrCN, CrN etc.
1. Cost-efficient production
2. Humanization of the work station (ergonomic design of the work station,minimizing of space ,noise and danger of accident)
3. High quality yield.
4. Strong adhesion with powerful heating-up device and plasma source cleaning;
5. Compact design and with easy access for upgrading and maintenance work.
6. Fully Automation, PLC+Touch Screen, one-touch control system.
7. High efficiency with less power consumption, max. 50% production cost saving.
1. Ultimate Vacuum Pressure: better than 9.0*10-5 Pa;
Base Vacuum pressure: 3.0*10-2 Pa
3. Pumping down Time: from atm to 1.0×10-3 Pa≤15 minutes ( room temperature, dry, clean and empty chamber)