Copper Valves and Caps PVD Plating Equipment, Casting Alloy Piping and Plumbings Chroming Machine
What is Sputter Deposition ( also named as Magnetron sputtering deposition)
Sputtering is a metal deposition process where the target material is not vaporized using heat, but its metal atoms are physically dislodged from the target by the collision of a bombarding particle. The distance from the target to the part in a sputtering chamber is much shorter than in vacuum deposition. Sputtering is also done under much higher vacuum. The sputtering source itself can be made of elements, alloys, mixtures, or compounds. This form of metal deposition is commonly used in semiconductor manufacturing, on architectural glass, reflective coatings, compact discs CDs, and decorative coatings.
What is Arc Vapor Deposition ( also named as cathodic arc plating process)
Cathodic arc deposition or Arc-PVD is a physical vapor deposition technique in which an electric arc is used to vaporize material from a cathode target. The vaporized material then condenses on a substrate, forming a thin film. The technique can be used to deposit metallic, ceramic, and composite films. The arc evaporation process begins with the striking of a high current, low voltage arc on the surface of a cathode ( known as the target) that gives rise to a small (usually a few micrometers wide), highly energetic emitting area known as a cathode spot. The localized temperature at the cathode spot is extremely high ( around 15000℃), which results in a high evlocity (10km/sec) jet of vaporized cathode material, leaving a crater behind on the cathode surface.
The Copper Valves and Caps PVD Plating Equipment- RTAC950-SP, contains cathodic arc source, MF and DC sputter sources, plus the Ion source device, which can cover all kinds substrate materials: metal alloys, brass, Zamak ( Zinc alloy) , plastic, electronics, piping and plumbings, plumber fittings, watering system valves and caps; medical and industrial valves etc. The process purpose is mainly to replace the Chromium Electroplating which is hazardous for human and environment.
RTAC950-SP Design Features:
1. Flexibility: arc and sputter sources, linear ion source devices mounting flanges are standardized for flexible exchange
2. Versatility: available for deposit variety of base metals and alloys, optical coatings and hard coatings, soft coatings. Compound films and solid lubricating films on the metallic and non-metallic materials substrates
3. Straight forward design: 2-door structure, front and back opening for easy maintenance.
Layout of RTAC950-SP -PVD Thin Film Deposition Machine
Copper Plumber Fittings and Valves, Caps PVD plating samples
Please consult us with your expected solutions you want to get from Royaltec, we provide the turn-key coating solutions on this application.