Magnetron Sputtering Sources Specifications
Key Features
1. Finite element magnetic field design
2. Magnet isolated from cooling water
3. Compatible with DC/MF and RF Powers
4. High target utilization
5. Adjustable ejecting direction
6. High power density and excellent uniformity
7. Balanced and unbalanced mode choice
| Maximum Sputtering Power | |
| Indirect Cooled target | > 20 Watts / cm2 (DC) |
| > 7 Watts / cm2 (RF) | |
| Discharge Voltage/ | 100 to 1500 volts |
| Discharge Current | > 0.05 amps / cm2 |
| Operating Pressure | 0.05 to 5 Pa |
| Target utilization | > 35% |
| Target | |
| Form | Rectangular/ Planar |
| Thickness | 6mm~16mm |
| Width | 125mm |
| Installation | Internal/external |
Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions
