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RTSP1200-PCB- Printed Circuit Board PVD Gold Sputtering

RTSP1200-PCB- Printed Circuit Board PVD Gold Sputtering
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Application: Flexible Electronics Industry, Printed Circuit Board
Technology: DC/MF Magnetron Sputtering Deposition, Ion Beam
Coating Films: Au Gold, Ag Silver, Cu Copper Conductive Families Films; Corrosion Resistance Metal Families: Tantalum(Ta), Nickle (Ni), Chrome (Cr), Zirconium(Zr) Etc. Compounded Films: Carbon-based Metal Films, Nitride Metal Films.
Factory Location: Shanghai City, China
Worldwide Service: Poland - Europe; Iran- West Asia & Middle East, Turkey, India, Mexico- South America
Training Service: Machine Operation, Maintenance, Coating Process Recipes, Program
Warranty: Limited Warranty 1 Year For Free, Whole Life For Machine
OEM & ODM: Available, We Support Tailor Made Design And Fabrication
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Basic Infomation
Place of Origin: MADE IN CHINA
Certification: CE
Model Number: RTSP1200-PCB
Payment & Shipping Terms
Packaging Details: Export standard, to be packed in new cases/cartons, suitable for long-distance ocean/air and inland transportation.
Delivery Time: 12 weeks
Payment Terms: L/C, T/T
Supply Ability: 10 sets per month
Product Description

Technical Background

The RTSP1200-PCB machine is a tailor-designed and fabricated equipment for PCBs plating by magnetron sputtering deposition technology.

Everyone who is involved with the PCB industry knows that PCBs which have copper finishes on the surface requires a protective layer to protect it against from oxidize and deteriorate, meanwhile the film must with high hardness and abrasion resistance to guarantee the lifetime.

Royal Technology spent 6 months in R&D, over 20 times experiment to finalized the proper coating processes. More exciting new is in March 2020, we delivered the massive production machine to our customer’s site with a high accomplishment result.


Key Features

Multiple deposition cathodes for fast deposition rate
Strong vacuum pumping system for a short cycle
Anode linear ion source to improve adhesion and high density of deposited films
6 units standard planar cathodes mounting flanges
Flexible coating processes applied
Modular structure design for fast exchange of cathodes and targets


RTSP1200-PCB- Printed Circuit Board PVD Gold Sputtering 0

                                              Planar Sputtering Cathodes 


Technical Specifications


Description RTSP1200-PCB

Environmentally friendly process

Much lower production cost compared with conventional metal electroplating process

Excellent corrosion and wear resistance

Hign density and high uniformity

Film thickness can be well controlled

Deposited Films

Au gold, Ag silver, Cu copper conductive families films;

Corrosion resistance metal families: Tantalum(Ta), Nickle (Ni), Chrome (Cr), Zirconium(Zr) etc.

Compounded films: carbon-based metal films, Nitride metal films.

Deposition Chamber

Cylinder chamber with vertical orientation, one door structure with front opening method

Chammber inner size: φ1200 * H1500mm


Loading Volume (Max.) Central driving rack system, with Max. φ1000mm *H1100
Deposition Sources 4 Planar sputtering cathodes + 1 mounting flange for upgrading
Sputtering Deposition Power Max. 30KW
Pulsed Bias Power Max. 30KW
Footprint (L*W*H) 5000*5000*4500mm
Power Consumption

Max. 105KW


Operation & Control System

CE standard

Mitsubishi PLC+ Touch Screen

Operation Program with backup


These configurations are standard, for a specific developing market and new special coatings, the customized configurations and modifications are available on requests.



6-RT1200-PCB- Magnetron sputtering deposition equi...   for more details, please download catalogue here. 



RTSP1200-PCB- Printed Circuit Board PVD Gold Sputtering 1

                          Operation and Coating Process Training for Customers

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