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Brand Name: | ROYAL TECHNOLOGY |
Model Number: | RTSP1200-PCB |
MOQ: | 1 |
Price: | negotiable |
Payment Terms: | L/C,T/T |
Supply Ability: | 10 sets per month |
Technical Background
The RTSP1200-PCB machine is a tailor-designed and fabricated equipment for PCBs plating by magnetron sputtering deposition technology.
Everyone who is involved with the PCB industry knows that PCBs which have copper finishes on the surface requires a protective layer to protect it against from oxidize and deteriorate, meanwhile the film must with high hardness and abrasion resistance to guarantee the lifetime.
Royal Technology spent 6 months in R&D, over 20 times experiment to finalized the proper coating processes. More exciting new is in March 2020, we delivered the massive production machine to our customer’s site with a high accomplishment result.
Key Features
Multiple deposition cathodes for fast deposition rate
Strong vacuum pumping system for a short cycle
Anode linear ion source to improve adhesion and high density of deposited films
6 units standard planar cathodes mounting flanges
Flexible coating processes applied
Modular structure design for fast exchange of cathodes and targets
Planar Sputtering Cathodes
Applying PVD (Physical Vapor Deposition) coatings on Printed Circuit Boards (PCBs) can provide various benefits in terms of performance, protection, and aesthetics. Here's an overview of how PVD coatings can be advantageous for PCBs:
Benefits of PVD Coatings on PCBs:
Corrosion Resistance: PVD coatings can protect PCBs from corrosion caused by environmental factors, extending the lifespan of electronic devices.
Enhanced Electrical Performance: Certain PVD coatings can improve the electrical conductivity of PCB traces and components, reducing resistivity and signal loss.
Solderability: PVD coatings can enhance the solderability of PCB pads and components, ensuring reliable solder joints during assembly.
Wear Resistance: PVD coatings can protect PCB surfaces from wear, scratches, and abrasion during handling and use.
Thermal Management: Some PVD coatings offer thermal management properties, aiding in heat dissipation and improving the overall performance of electronic devices.
Aesthetics: PVD coatings can provide a visually appealing finish to PCBs, adding a decorative element to electronic products.
Common Types of PVD Coatings for PCBs:
Titanium Nitride (TiN): Offers excellent corrosion resistance, wear resistance, and a gold-colored finish.
Titanium Carbon Nitride (TiCN): Combines the properties of TiN and improved hardness for increased wear resistance.
Aluminum Titanium Nitride (AlTiN): Provides enhanced oxidation resistance and high-temperature stability.
Application of PVD Coatings on PCBs:
Cleaning and Preparation: The PCB surface is thoroughly cleaned and prepared to ensure proper adhesion of the PVD coating.
PVD Deposition: The PCB is placed in a PVD chamber where the desired coating material is vaporized and deposited onto the surface under vacuum conditions.
Controlled Thickness: The thickness of the PVD coating can be precisely controlled to meet the requirements of the PCB design.
Quality Assurance: Post-coating inspections are typically carried out to verify coating uniformity, adhesion, and overall quality.
By utilizing PVD coatings on PCBs, manufacturers can enhance the performance, durability, and aesthetic appeal of electronic devices while ensuring their long-term reliability.
Technical Specifications
Description | RTSP1200-PCB |
Advantages |
Environmentally friendly process Much lower production cost compared with conventional metal electroplating process Excellent corrosion and wear resistance Hign density and high uniformity Film thickness can be well controlled |
Deposited Films |
Au gold, Ag silver, Cu copper conductive families films; Corrosion resistance metal families: Tantalum(Ta), Nickle (Ni), Chrome (Cr), Zirconium(Zr) etc. Compounded films: carbon-based metal films, Nitride metal films. |
Deposition Chamber |
Cylinder chamber with vertical orientation, one door structure with front opening method Chammber inner size: φ1200 * H1500mm |
Loading Volume (Max.) | Central driving rack system, with Max. φ1000mm *H1100 |
Deposition Sources | 4 Planar sputtering cathodes + 1 mounting flange for upgrading |
Sputtering Deposition Power | Max. 30KW |
Pulsed Bias Power | Max. 30KW |
Footprint (L*W*H) | 5000*5000*4500mm |
Power Consumption |
Max. 105KW Average:50KW |
Operation & Control System |
CE standard Mitsubishi PLC+ Touch Screen Operation Program with backup |
These configurations are standard, for a specific developing market and new special coatings, the customized configurations and modifications are available on requests.
Operation and Coating Process Training for Customers