Copper Circuit Board TiN Coating Machine , MF Magnetron Sputtering System
1 set
Copper Circuit Board TiN Coating Machine ,  MF Magnetron Sputtering System
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Basic Infomation
Place of Origin: Made in China
Brand Name: ROYAL
Certification: ISO, CE, UL Standard
Model Number: RTSP1215-MF
High Light:

tin coating machine


titanium coating machine

Payment & Shipping Terms
Packaging Details: Export standard, to be packed in new cases/cartons, suitable for long-distance ocean/air and inland transportation.
Delivery Time: 8 to 12 weeks
Payment Terms: L/C, D/A, D/P, T/T
Supply Ability: 15 sets per month
Vacuum Technology: MF Magnetron Sputtering, Ion Source Plasma Cleaning
Deposition Sources: Sputtering Cathodes
Coating Films: Metal Film Plating, Titanium Nitride, Titanium Carbide, Zirconium Nitride, Chromium Nitride, TiAlN, CrC
Industrial Applications: Electronics Module, Circuit Board, Hard Coatings, PVD Decorations
Deposition Chamber: 8-sides Chamber
Product Description

Copper Circuit Board TiN PVD Coating Machine / PVD TiN Decorations Plating on Brass Board



The PVD machine model: RTSP1215-MF is designed and developed to deposit TiN gold coating on Copper circuit board. The TiN thin film generated in high vacuum environment, which highly enhanced the uniformity and purity.


Copper Circuit Board TiN PVD Coating Machine design features:

1. 8-sides chamber with equal sizes mounting flanges, which can assemble and exchange Ion source and Sputtering cathodes or Arc cathodes flexiblely based on the coating processes demand.

2. Compact design which only occupy 20sqm;

3. Ion source for plasma cleaning pre-treatment and Ion-beam assisted deposition to enhance the film adhesion.

4. High pumping speed package and stable configuration, the magnetically suspension molecular pumps can be mounted in any direction.



Copper Circuit Board TiN PVD Coating Machine Specifications



1. Ultimate Vacuum Pressure: better than 5.0×10-6 Torr.

2. Operating Vacuum Pressure: 1.0×10-4 Torr.

3. Pumpingdown Time: from 1 atm to 1.0×10-4 Torr≤ 3 minutes ( room temperature, dry, clean and empty chamber)

4. Metalizing material (sputtering + Arc evaporation): Ni, Cu, Ag, Au, Ti, Zr, Cr etc.

5. Operating Model: Full Automatically /Semi-Auto/ Manually



The vacuum coating machine contains key completed system listed below:

1. Vacuum Chamber

2. Rouhging Vacuum Pumping System (Backing Pump Package)

3. High Vacuum Pumping System ( Magnetically Suspension Molecular Pump)

4. Electrical Control and Operation System

5. Auxiliarry Facility System (Sub System)

6. Deposition System


RTSP1215-MF Technical Data
TECHNOLOGY Magnetron Sputtering (MF)
MATERIAL Stainless Steel (S304)
CHAMBER SIZE Φ1200*H1500mm
CHAMBER TYPE 8-sides, vertical, 1-door
SPUTTERING SYSTEM 4 sets Planar Sputtering Cathodes
DEPOSITION MATERIAL Aluminum, Silver, Copper, Chrome, Stainless Steel, Nickel, Titanium, TiN
DEPOSITION SOURCE 4 Planar Sputtering Cathodes + Ion Source for Plasma cleaning
GAS MFC- 2 ways, Ar, N2
CONTROL PLC(Programmable Logic Controller) +
Touch Screen
PUMP SYSTEM SV300B - 1 set (Leybold)
WAU1001 - 1 sets (Leybold)
D60T- 1 set (Leybold)
MGK3304 - 2 sets ( Osaka)
PRE-TREATMENT Bias power supply: 1*36 KW
SAFETY SYSTEM Numerous safety interlocks to protect operators
and equipment
COOLING Cold Water
POWER ELECTRICAL 480V/3 phases/60HZ ( USA compliant)
460V/3 phases/50HZ ( Asia compliant)
380V/3 phases/50HZ ( EU-CE compliant)
FOOTPRINT L3000*W3000*H2000mm
FOOTPRINT ( L*W*H) 5000*4000 *4000 MM
CYCLE TIME 30~40 minutes (depending on substrate material,
substrate geometry and environmental conditions)


Copper Circuit Board TiN Coating Machine ,  MF Magnetron Sputtering System 0




Copper Circuit Board TiN PVD Coating Sample


Copper Circuit Board TiN Coating Machine ,  MF Magnetron Sputtering System 1



Copper Circuit Board TiN Coating Machine ,  MF Magnetron Sputtering System 2





Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.

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Get in touch with us
Contact Person : Ms. ZHOU XIN
Fax : 86-21-67740022
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