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PVD EMI Shielding Thin Film Vacuum Metallizing Equipment,

1 set
MOQ
negotiable
Price
PVD EMI Shielding Thin Film Vacuum Metallizing Equipment,
Features Gallery Product Description Request A Quote
Features
Specifications
Chamber: Vertical Orientation, 2-doors
Deposition Source: Thermal Filament Evaporation + Sputtering Metalization
Deposition Materials: Copper, Stainless Steel
Applications: Plastic And Metal Cutlery, Ceramic, Electronics Product, Cellphone Housing, NCVM Applications, Decorative Items, Metallic Finish.
Factory Location: Shanghai City, China
Worldwide Service: Poland - Europe; Iran- West Asia & Middle East, Turkey, India, Mexico- South America
Training Service: Machine Operation, Maintenance, Coating Process Recipes, Program
Warranty: Limited Warranty 1 Year For Free, Whole Life For Machine
OEM & ODM: Available, We Support Tailor Made Design And Fabrication
High Light:

small pvd coating machine

,

vacuum coating plant

Basic Infomation
Place of Origin: Made in China
Brand Name: ROYAL
Certification: TUV CE
Model Number: RT1600-EMI
Payment & Shipping Terms
Packaging Details: Export standard, to be packed in new cases/cartons, suitable for long-distance ocean/air and inland transportation.
Delivery Time: 8~12 weeks
Payment Terms: L/C, T/T, D/A, D/P
Supply Ability: 10 sets per month
Product Description

EMI Shielding Thin Film Vacuum Metallizing Equipment, Vertical Orientation EMI PVD Coating Machine, Copper Evaporation​

 

 

 

EMI: Electro-magnetic Interference coating is specially designed for electrical and electronic devices to avoid from interference of electromagnetic.

Its high conductivity and high magnetc interference shielding properties are widely used in telecommunication devices, computers, consumer electronics, home appliance, aerospace and military devices

 

EMI shileding  surface treatment has been applied with cell phone industry  for years. Our customers are:

Sumgsung, Iphone, Lenovo, Huawei phones manufactures. 

 

 

Electro Magnetic Interference Shielding Metalizer Features

1) Suitable for plastics,ceramics,glass and metal,surfaces deposition,
2) Duo jig & rack designed structure,high productivity
3) High depositing speed,
4) Good uniformity & accurate coating thickness control

5) Excellent adhesion

 

Electro Magnetic Interference Shielding Metalizer Specifications:

 

MODEL  RTEP1616-SP
TECHNOLOGY

THERMAL EVAPORATION, TUNGSTEN ,FILAMENT, glow discharge, magnetron

sputtering

MATERIAL Stainless Steel (S304)
CHAMBER SIZE Φ1600*1600mm (H)
CHAMBER TYPE Cylinder, horizontal, 1-door
EVAPORTATION SYSTEM EXCLUSIVE DESIGN FOR EMI coating
DEPOSITION MATERIAL Silver, Copper, Stainless Steel, Nickel
DEPOSITION SOURCE TUNGSTEN FILAMENT + magnetron sputtering
CONTROL PLC(Programmable Logic Controller) + Touch Screen
PUMP SYSTEM Rotary Piston Vacuum Pump
Rotary Vane Vacuum Pump
Roots Vacuum Pump
Difussion Pump + Brooks Polycold
PRE-TREATMENT Plasma Cleaning
SAFETY SYSTEM Numerous safety interlocks to protect operators and equipment
COOLING Cold Water
POWER ELECTRICAL 480V/3 phases/60HZ ( USA compliant)
460V/3 phases/50HZ ( Asia compliant)
380V/3 phases/50HZ ( EU-CE compliant)
FOOTPRINT L9000*W4200*H3000mm
TOTAL WEIGHT 10.0 T
CYCLE TIME 15 minutes (depending on substrate material, substrate geometry and environmental conditions)
POWER MAX.. 90KW
AVERAGE POWER CONSUMPTION (APPROX.) 45KW

 

PVD EMI Shielding Thin Film Vacuum Metallizing Equipment, 0

 

 

EMI Shielding Film Coating Properties

Film thickness : 1.5 ~ 3 microns depends on the requirement.

Film resistance: (ohm)  better than 0.5Ω

 

Adhesion: 3M810 tape > 5B  

 

Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.

 

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