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Vacuum Flask Copper Plating Equipment, Copper Sputtering Deposition System, TiN and TiC Vacuum Plating

China Vacuum Flask Copper Plating Equipment,  Copper Sputtering Deposition System, TiN and TiC Vacuum Plating supplier
Vacuum Flask Copper Plating Equipment,  Copper Sputtering Deposition System, TiN and TiC Vacuum Plating supplier Vacuum Flask Copper Plating Equipment,  Copper Sputtering Deposition System, TiN and TiC Vacuum Plating supplier Vacuum Flask Copper Plating Equipment,  Copper Sputtering Deposition System, TiN and TiC Vacuum Plating supplier Vacuum Flask Copper Plating Equipment,  Copper Sputtering Deposition System, TiN and TiC Vacuum Plating supplier

Large Image :  Vacuum Flask Copper Plating Equipment, Copper Sputtering Deposition System, TiN and TiC Vacuum Plating

Product Details:

Place of Origin: Made in China
Brand Name: ROYAL
Certification: ISO, CE, UL Standard
Model Number: RTAC-SP

Payment & Shipping Terms:

Minimum Order Quantity: 1 set
Price: Negotiable
Packaging Details: Export standard, to be packed in new cases/cartons, suitable for long-distance ocean/air and inland transportation.
Delivery Time: 12 weeks
Payment Terms: L/C, D/A, D/P, T/T
Supply Ability: 10 sets per month
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Detailed Product Description
Vacuum Technology: Cathodic Multi Arc Plating, PVD Arc Deposition, Magnetron Sputtering By DC Deposition Sources: Cylinder Arc Or Circular Arc Cathodes, DC Sputter Source
Coating Films: Metal Film Plating, Titanium Nitride, Titanium Carbide, Zirconium Nitride, Chromium Nitride, TiAlN, CrC Applications: Watering Piping And Plumbings; Bathroom Fittings And Faucets Valves,

Vacuum Flask Copper Plating Equipment, Copper Sputtering Deposition System, TiN and TiC Vacuum Plating

 

 

 The thick copper film is for thermal isulation between inner and outer bottles.  In the surface with PVD vacuum coating technology to generate various colors:  black, rainbow, gold, copper, brown etc. 

 

Sputter Deposition

Sputtering is a metal deposition process where the target material is not vaporized using heat, but its metal atoms are physically dislodged from the target by the collision of a bombarding particle. The distance from the target to the part in a sputtering chamber is much shorter than in vacuum deposition. Sputtering is also done under much higher vacuum. The sputtering source itself can be made of elements, alloys, mixtures, or compounds. This form of metal deposition is commonly used in semiconductor manufacturing, on architectural glass, reflective coatings, compact discs CDs, and decorative coatings. 

 

Arc Vapor Deposition

Cathodic arc deposition or Arc-PVD is a physical vapor deposition technique in which an electric arc is used to vaporize material from a cathode target. The vaporized material then condenses on a substrate, forming a thin film. The technique can be used to deposit metallic, ceramic, and composite films. The arc evaporation process begins with the striking of a high current, low voltage arc on the surface of a cathode ( known as the target) that gives rise to a small (usually a few micrometers wide), highly energetic emitting area known as a cathode spot. The localized temperature at the cathode spot is extremely high ( around 15000℃), which results in a high evlocity (10km/sec) jet of vaporized cathode material, leaving a crater behind on the cathode surface.

 

Royal technology designed and fabricated the RTAC-SP series PVD vacuum metallizing equipment are 

popular used  for metal alloys, brass, Zamak ( Zinc alloy) , plastic, electronics,  piping and plumbings, plumber fittings, watering system valves and caps; medical and industrial valves etc. The process purpose is mainly to replace the Chromium Electroplating which is hazardous for human and environment. 

 

Vacuum Flask Copper Plating Equipment,  Copper Sputtering Deposition System, TiN and TiC Vacuum Plating

Vacuum Flask Copper Plating Equipment,  Copper Sputtering Deposition System, TiN and TiC Vacuum Plating

Vacuum Flask Copper Plating Equipment,  Copper Sputtering Deposition System, TiN and TiC Vacuum Plating

 

The High Vacuum Metallizing System Configurations and Features:

 

Model RTAC1008-SPMF RTAC1250-SPMF RTAC1615-SPMF
Effective Chamber Size Φ1000 x H800mm Φ1250 x H1250mm Φ1600 x H1500mm
Deposition Sources

Cylinder Arc (steered circular arc for option) +MF Sputtering Cathode +

Linear Ion Source

Vacuum Pumping System ( Leybold Pumps + Turbo Molecular Pump)

 

SV300B - 1 set (300m³/hr) SV300B - 1 set (300m³/hr) SV300B - 2 set (300m³/hr)
 

WAU1001-1set

(1000m³/hr)

WAU1001-1set

(1000m³/hr)

WAU2001-1set

(1000m³/hr)

  D60T- 1 set (60m³/hr) D60T- 1 set (60m³/hr) D60T- 1 set (60m³/hr)
 

Turbo Molecular Pumps:

2 sets (3500L/S)

Turbo Molecular Pumps:

2 sets (3500L/S)

Turbo Molecular Pumps:

3 sets (3500L/S)

Sputtering Power Supply 1*24KW (MF) 2*36KW(MF) 3*36KW(MF)
Arc Power Supply 6*5KW 7*5KW 8*5KW
Bias Power Supply 1*24KW 1*36KW 1*36KW
Planetary Rods 6/8 12/16 20
Heaters 6*2.5KW 8*2.5KW 9*2.5KW
Ultimate Vacuum 9.0*10-4Pa (empty, clean,room temperature) 9.0*10-4Pa (empty, clean,room temperature) 9.0*10-4Pa (empty, clean,room temperature)
Cycle Time (depends on pump) 40’~50’ depends on substrate material and coating recipes
Working Power Requirement 3Phase 4 lines,AC380V,50HZ,35KW 3Phase 4 lines,AC380V,50HZ,120KW 3Phase 4 lines,AC380V,50HZ,150KW
Cooling Water YES, industrial water chiller
Processing Gas (99.99%) 4 ways 4 ways 4 ways
Footprint (mm) 2000*2000*2300 4000*4500*3200 5500*5000*3600
Total Weight(KGS) 4500 7000 9000
Total Power Consumption(Approx.) 50KW 110KW 170KW
Actual Power Consumption(Approx.) 30KW 60KW 80KW

 

Above technical parameters only for reference, Royaltec reserves the right for final production based on specified applications.

 

Please consult us with your expected solutions you want to get from Royaltec, we provide the turn-key coating solutions on this application.

 

Contact Details
SHANGHAI ROYAL TECHENOLOGY INC.

Contact Person: Shelly

Tel: +8618721235825

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