Laboratory Magnetron Sputtering Vacuum Coating System
1. The UHV sputtering system is equipped with
2. The UHV sputtering system applications of
Application of conductive coatings on glass, ceramics and other dielectric materials.
3. Technical Performance:
3. 1 Ultimate Vacuum Pressure: better than 5.0×10-6 Torr.
3. 2. Operating Vacuum Pressure: 1.0×10-4 Torr.
3. 3. Pumpingdown Time: from 1 atm to 1.0×10-4 Torr≤ 3 minutes ( room temperature, dry, clean and empty chamber)
3. 4. Metalizing material (sputtering ) Al, Cr, Sn, Ti, SS, Cu… etc.
3. 5. Operating Model: Full Automatically /Semi-Auto/ Manually
The UHV Sputtering vacuum coating machine contains key completed system listed below:
1. Vacuum Chamber
2. Rouhging Vacuum Pumping System (Backing Pump Package)
3. High Vacuum Pumping System (Diffusion Pump)
4. Electrical Control and Operation System
5. Auxiliarry Facility System (Sub System)
6. Deposition System
For more specifications, please contact us. Customized inquiries are welcomed.