DPC - Magnetron Sputtering Deposition System , Direct Plating Cooper On LED Ceramic Substrates
1 set
MOQ
negotiable
Price
DPC - Magnetron Sputtering Deposition System ,  Direct Plating Cooper On LED Ceramic Substrates
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Features
Basic Infomation
Place of Origin: Made in China
Brand Name: ROYAL
Certification: CE
Model Number: RTAC1215-SP
High Light:

small pvd coating machine

,

vacuum coating plant

Payment & Shipping Terms
Packaging Details: Export standard, to be packed in new cases/cartons, suitable for long-distance ocean/air and inland transportation.
Delivery Time: 12 weeks
Payment Terms: L/C, T/T
Supply Ability: 6 sets per month
Specifications
Deposition Sources: Magnetron DC / MF Sputtering + Steered Cathodic Arc
Deposition Films: Ni, Cu, Ag, Au, Ti, Zr, Cr Etc.
Applications: LED Ceramic Chips With Cooper Plating, Al2O3, AlN Ceramic Circuit Boards, Al2O3 Plates On LED, Semiconductor
Film Features: Wear Resistance, Strong Adhesion, Decorative Coating Colors
Factory Location: Shanghai City, China
Factory Location: Shanghai City, China
Worldwide Service: Poland - Europe; Iran- West Asia & Middle East, Turkey, India, Mexico- South America
Training Service: Machine Operation, Maintenance, Coating Process Recipes, Program
Training Service: Machine Operation, Maintenance, Coating Process Recipes, Program
Warranty: Limited Warranty 1 Year For Free, Whole Life For Machine
Warranty: Limited Warranty 1 Year For Free, Whole Life For Machine
Warranty: Limited Warranty 1 Year For Free, Whole Life For Machine
Warranty: Limited Warranty 1 Year For Free, Whole Life For Machine
OEM & ODM: Available, We Support Tailor Made Design And Fabrication
OEM & ODM: Available, We Support Tailor Made Design And Fabrication
OEM & ODM: Available, We Support Tailor Made Design And Fabrication
OEM & ODM: Available, We Support Tailor Made Design And Fabrication
OEM & ODM: Available, We Support Tailor Made Design And Fabrication
Product Description

Copper Magnetron Sputtering Deposition System , Direct Plating Cooper On LED Ceramic Substrates

 

 

Performance

1. Ultimate Vacuum Pressure: better than 5.0×10-6 Torr.

2. Operating Vacuum Pressure: 1.0×10-4 Torr.

3. Pumpingdown Time: from 1 atm to 1.0×10-4 Torr≤ 3 minutes ( room temperature, dry, clean and empty chamber)

4. Metalizing material (sputtering + Arc evaporation): Ni, Cu, Ag, Au, Ti, Zr, Cr etc.

5. Operating Model: Full Automatically /Semi-Auto/ Manually

 

Structure

The vacuum coating machine contains key completed system listed below:

1. Vacuum Chamber

2. Rouhging Vacuum Pumping System (Backing Pump Package)

3. High Vacuum Pumping System ( Magnetically Suspension Molecular Pump)

4. Electrical Control and Operation System

5. Auxiliarry Facility System (Sub System)

6. Deposition System

 

Copper Sputtering Coating Machine Key Features

 

1. Equipped with 8 steer arc cathodes and DC Sputtering Cathodes, MF Sputtering Cathodes, Ion source unit. 

2. Multilayer and co-deposition coating available

3. Ion source for plasma cleaning pre-treatment and Ion-beam assisted deposition to enhance the film adhesion. 

4. Ceramic/ Al2O3/AlN substrates heating up unit; 

5. Substrate rotation and revolution system, for 1-side coating and 2-sides coating. 

 

The DPC named Direct Plated Copper, also known as Directly Copper Plating Substrates. The DPC process:

1. Firstly, get Copper plated on ceramic substrate directly with PVD technology. It contains plasma cleaning, cooper sputtering deposition steps, which generate a layer of thin copper layer on ceramic chips;

2. Secondly is the exposure, development, etching, film removing flow chart;

3. At last, use the electroplating/chemical plating process to increase the deposition film thickness until the photoresist is removed, the metalization process is finished.

 

DPC process ceramic substrate features:

1. Much lower production cost.

2. Outstanding thermal management and heat-transfer performance

3. Accurate alignment and pattern design,

4. High circuit density

5. Good adhesion and solderability

 

Due to these advanced performance, the DPC substrates are widely used in various applications:

High brightness LED to increase the long life time because of its high heat radiation performance, Semiconductor equipment, microwave wireless communication, military electronics, various sensor substrates, aerospace, railway transportation, electricity power , etc

 

 

RTAC1215-SP equipment is exclusively designed for DPC process which get the cooper layer on substrates. This equipment utilizes PVD physical vapor deposition principle, with multi-arc ion plating and magnetron sputtering techniques to obtain the ideal film with high density, high abrasion resistance, high hardness and strong binding in high vacuum environment. It is the crucial step for rest DPC process.

 

Sputtering Cathode: 

 

DPC - Magnetron Sputtering Deposition System ,  Direct Plating Cooper On LED Ceramic Substrates 0

 

Ion Source Plasma Cleaning 

 

DPC - Magnetron Sputtering Deposition System ,  Direct Plating Cooper On LED Ceramic Substrates 1

 

 

 

Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.

 

 
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