Copper Magnetron Sputtering Coating Machine / High Vacuum Magnetron Sputtering Deposition System
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Copper Magnetron Sputtering Coating Machine / High Vacuum Magnetron Sputtering Deposition System
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Features
Basic Infomation
Place of Origin: Made in China, Shanghai
Brand Name: ROYAL
Certification: CE certification
Model Number: RTSP
High Light:

magnetron sputtering machine

,

magnetron sputtering equipment

Payment & Shipping Terms
Packaging Details: 1*40HQ
Delivery Time: 16 weeks
Specifications
Technology: DC/MF Magnetron Sputtering Cathode
Pre-cleaning: Linear Anode Ion Source Plasma Pre-treatment
Sputtering Cathodes: MF 4 Sets; DC 2 Sets
Sputtering Targets: Carbon, Copper, Aluminum, ITO, Ti, Cr, Stainless Steel Etc.
Product Description

Copper/Aluminum/Carbon Sputtering Equipment, High Vacuum Magnetron Sputtering Deposition System

 

UHV Sputtering deposition system uses the sputtering cathodes as the PVD deposition sources. It always comibled MF sputter and DC sputters for indstrial PVD coating applications. Based on different targets and sputtering deposition speed's requests, Royal Technology provides cylidrical sputters and planar sputter cathodes, mainly for fast deposition rates to satisfy industrial production coating demand. 

 

 

Our High Vacuum Magnetron Sputtering Deposition System is designed for copper, alumunium, plastic, metal circuit board conductive film layer plating. It can condense Nano thin film on substrates. Except Ag sputtering, it can also deposit Ni, Au, Ag, Al, Cr, stainless steel targets.

It can deposite high uniformity films on various substrates: plastic panle, PC panle,  Aluminum sheet, Ceramic sheets, Al2O3 ceramic, AlN, Silicon sheets etc. 

 

 

RTSP1215   Sputtering Coating Equipment Layout

 

Copper Magnetron Sputtering Coating Machine / High Vacuum Magnetron Sputtering Deposition System 0

Copper Magnetron Sputtering Coating Machine / High Vacuum Magnetron Sputtering Deposition System 1

 

RTSP series Sputtering Coating Equipment Applications:

 

1. Available on substrates of: Plastic, Polymer, Glass and ceramic sheets, Stainless steel, Copper sheet, Aluminum board etc.

 

2. To generate Nano film like: TiN, TiC, TiCN, Cr, CrC, CrN, Cu, Ag, Au, Ni, Al etc.

 

 

RT-SP series Sputtering Coating Equipment Design Features:

 

1. Robust design, good for limited room space

2. Easy access for maintenance and repair

3. Fast pumping system for high yield

4. CE standard electrical enclosure, UL standard is also available.

5. Accurate fabrication workmanship

6. Stable running to guarantee high quality film production.

 

 

Ion source is original from Gencoa company, the properties:

 

1. Optimized magnetic fields to produce a collimated plasma beam at standard sputtering pressures

2. Automated regulation for the gas to maintain constant current & voltage – multi-gas auto control

3. Graphite anode and cathode to protect the substrate from contamination and provide long-life components

4. RF standard electrical insulation on all ion sources

5. In-direct cooling of anode and cathode – quick switching of parts

6. Easy switching of cathode parts to provide multiple magnetic traps for lower voltage operation, or a focused beam

7. Voltage regulated power supply with gas adjustment feedback to maintain same current at all times

 

 

High Vacuum Magnetron Sputtering Deposition System Technical Specifications:

 

MODEL RT1215-SP
MATERIAL Stainless Steel (S304)
CHAMBER SIZE Φ1200*1500mm (H)
CHAMBER TYPE 1-door structure, Vertical
SINGLE PUMP PACKAGE Rotary VaneVacuum Pump
Roots Vacuum Pump
Magnetic Suspension Molecular Pump
Two-stage rotary vane vacuum pump
TECHNOLOGY MF Magnetron Sputtering, Linear Ion Source
POWER SUPPLY Sputtering power supply + Bias Power supply + Ion Source
DEPOSITION SOURCE 4 pairs MF Sputtering Cathodes + Ion Source + DC sputters
CONTROL PLC+Touch Screen
GAS Gas Mass Flow Meters ( Ar, N2, C2H2, O2) Argon, Nitrogen and Ethyne,Oxygen
SAFETY SYSTEM Numerous safety interlocks to protect operators and equipment
COOLING Cooling Water
CLEANING Glow Discharge/Ion Source
POWER MAX. 120KW
AVERAGE POWER CONSUMPTION 70KW

 

Copper/Aluminum/Carbon Sputtering Equipment Key Components:

 

1. Strong Pumping System: Leybold backing pumps + Osaka Magnetic Suspension Molecular Pump

 

Copper Magnetron Sputtering Coating Machine / High Vacuum Magnetron Sputtering Deposition System 2

2. Water/Gas Cabinet  Distribution System 

Copper Magnetron Sputtering Coating Machine / High Vacuum Magnetron Sputtering Deposition System 3

 

3. Sputtering Cathodes Distribution System

 

 

Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.

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Get in touch with us
Contact Person : Ms. ZHOU XIN
Fax : 86-21-67740022
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