Au Gold Sputtering Deposition Equipment, Silve/Gold PVD Deposition Machine, Conductive Film PVD Sputtering System
Summary: The DPC process- Direct Plating Copper is an advanced coating technology applied with LED / semiconductor / electronic industries. One typical application is Ceramic Radiating Substrate. Cooper conductive film deposition on Aluminum Oxide (Al2O3), AlN substrates by PVD vacuum sputtering technology, compared with traditional manufacturing
methods: DBC LTCC HTCC, much lower production cost is its high feature.
Royal technology team assisted our customer to developed the DPC process successfully with PVD sputtering technology.
Keywords: Ceramic sealing parts, DPC process, Copper PVD Sputtering system, LED Ceramic Chips With Cooper Plating, Al2O3, AlN Ceramic Circuit Boards, Al2O3 Plates On LED, Semiconductor
Applications of DPC:
· Substrates for solar concentrator cells
· Power semiconductor packaging including automotive motor control
· Hybrid and electric automobile power management electronics
· Packages for RF
· Microwave devices
DPC Technology Performance
Various substrate materials: Ceramic (Al3O2, AlN), Glass, and Si
Much lower production cost.
Outstanding thermal management and heat-transfer performance
Accurate alignment and pattern design
Robust metallization adhesion
High throughput up to 2.2 ㎡ Ceramic substrate per cycle;
Strong adhesion with powerful heating-up device and plasma source cleaning;
Compact design and with easy access for upgrading and maintenance work.
Fully Automation, PLC+Touch Screen, one-touch control system.
High efficiency with less power consumption, max. 50% production cost saving.
1. Ultimate Vacuum Pressure: better than 9.0*10-5 Pa;
Base Vacuum pressure: 3.0*10-2 Pa
3. Pumping down Time: from atm to 1.0×10-3 Pa≤15 minutes ( room temperature, dry, clean and empty chamber)