Balance/Unbalanced Closed Magnetic Filed Sputtering Coating System, Direct Plated Copper Vacuum Sputtering Plant
The Mangetron Sputtering Coater RTSP1215 is esigned for copper, alumunium, plastic, metal circuit board conductive film layer plating. It can condense Nano thin film on substrates. Except Ag sputtering, it can also deposit Ni, Au, Ag, Al, Cr, SS316L.
The RTSP1215 machine is installed with 2 pairs of MF sputtering cathodes on chamber, before PVD film deposition and 1 set of Anode Layer Ion source for plasma bombardment cleaning.
Ion source is original from Gencoa company, the properties:
1. Optimized magnetic fields to produce a collimated plasma beam at standard sputtering pressures
2. Automated regulation for the gas to maintain constant current & voltage – multi-gas auto control
3. Graphite anode and cathode to protect the substrate from contamination and provide long-life components
4. RF standard electrical insulation on all ion sources
5. In-direct cooling of anode and cathode – quick switching of parts
6. Easy switching of cathode parts to provide multiple magnetic traps for lower voltage operation, or a focused beam
7. Voltage regulated power supply with gas adjustment feedback to maintain same current at all times