Balance/Unbalanced Closed Magnetic Filed Sputtering Coating System, Direct Plated Copper Vacuum Sputtering Plant
The Mangetron Sputtering Coater RTSP1215 is esigned for copper, alumunium, plastic, metal circuit board conductive film layer plating. It can condense Nano thin film on substrates. Except Ag sputtering, it can also deposit Ni, Au, Ag, Al, Cr, SS316L.
The RTSP1215 machine is installed with 2 pairs of MF sputtering cathodes on chamber, before PVD film deposition and 1 set of Anode Layer Ion source for plasma bombardment cleaning.
Ion source is original from Gencoa company, the properties:
1. Optimized magnetic fields to produce a collimated plasma beam at standard sputtering pressures
2. Automated regulation for the gas to maintain constant current & voltage – multi-gas auto control
3. Graphite anode and cathode to protect the substrate from contamination and provide long-life components
4. RF standard electrical insulation on all ion sources
5. In-direct cooling of anode and cathode – quick switching of parts
6. Easy switching of cathode parts to provide multiple magnetic traps for lower voltage operation, or a focused beam
7. Voltage regulated power supply with gas adjustment feedback to maintain same current at all times
RTSP1215 Sputtering Coating Equipment Applications:
1. Available on substrates of: Plastic, Polymer, Glass and ceramic sheets, Stainless steel, Copper sheet, Aluminum board etc.
2. To generate Nano film like: TiN, TiC, TiCN, Cr, CrC, CrN, Cu, Ag, Au, Ni, Al etc.
RTSP1215 Sputtering Coating Equipment Design Features:
1. Robust design, good for limited room space
2. Easy access for maintenance and repair
3. Fast pumping system for high yield
4. CE standard electrical enclosure, UL standard is also available.
5. Accurate fabrication workmanship
6. Stable running to guarantee high quality film production.
The key feature is that Royal's customized operation and control program and software, which is available to meet various requests from customer's demands. The control system is PLC + Touch screen:
PLC remote monitoring and control ( Local Area Network )
1) Remote control Team View Program
2) PLC program back up + HMI program back up
3) PC operating environment
System:Window 2000/Window XP/Window 7
|MATERIAL||Stainless Steel (S304)|
|CHAMBER SIZE||Φ1200*1500mm (H)|
|CHAMBER TYPE||1-door structure, Vertical|
|SINGLE PUMP PACKAGE||Rotary VaneVacuum Pump|
|Roots Vacuum Pump|
|Magnetic Suspension Molecular Pump|
|Two-stage rotary vane vacuum pump|
|TECHNOLOGY||MF Magnetron Sputtering, Linear Ion Source|
|POWER SUPPLY||Sputtering power supply + Bias Power supply + Ion Source|
|DEPOSITION SOURCE||2 pairs MF Sputtering Cathodes + Ion Source|
|GAS||Gas Mass Flow Meters ( Ar, N2, C2H2, O2) Argon, Nitrogen and Ethyne,Oxygen|
|SAFETY SYSTEM||Numerous safety interlocks to protect operators and equipment|
|CLEANING||Glow Discharge/Ion Source|
|AVERAGE POWER CONSUMPTION||70KW|
Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.