Plastic Horizontal High Vacuum Sputter Deposition System Dc Plasma Cleaning
Horizontal DC Sputtering Deposition Equipment, High Vacuum Sputtering Deposition System
PVD Magnetron Sputtering and Evaporation Metalizing System Application:
Glass bracelets, Plastic cutlery, Ceramic, Electronics product, Cellphone housing, NCVM applications, Decorative items, Metallic finish.
Coating Films: Metal film, semi-transparent film, Mobile phone EMI, NCVM, Dielectric film; Protective coating, functional coating, decorative films deposition.
Vacuum Metalizing Substrates: plastic, glass, metal, ceramic etc.
RTEP-SP series Evaporation & Magnetron Sputtering coating machine consist of vacuum coating chamber , vacuum pumping system, deposition system, cooling system , electrical control system , workpiece rotating rack and ion source plasma cleaning unit. It is a duel function peice of equipment, the evaporation function is a high quality coating aluminum on the surface of plastic, mainly: PP, PC, PS, ABS, PMMA while the magnetron sputtering function is mainly specialized for plating stainless steel on the surface of plastic cutlery, automobile wheel, automobile part, etc.
Thermal Evaporation and Sputtering Metalizing Machine Features:
Dual chamber for independent loading operations.
Four types of coating process modes available for selection.
Option: RF generators or magnetron sputtering source can be installed for surface coating.
Uses planetary rotation mechanism to achieve good film uniformity on curved surface substrates.
Vacuum Coating VS Traditional Electroplating
Finishes are completely environmentally green;
High shiny, bright color reflective;
High volume production, low cost, ideal solution for mass production demand.
| MODEL | RTEP1620-SP | ||
| MATERIAL | Stainless Steel (S304) | ||
| CHAMBER SIZE | Φ1600*2000mm (H) | ||
| CHAMBER TYPE | Cylinder, 1-door, horizontal | ||
| RACK SYSTEM | 6 Planetary Rods * Φ430MM | ||
| EVAPORATION SOURCE | Copper Electrode and Tungsten Filaments | ||
| SPUTTING SOURCE | 2 planar sputtering targets: DC sputtering | ||
| PLASMA CLEANING | Planar Anode Ion Source ( Gencoa for option) | ||
| CONTROL | PLC(Programmable Logic Controller) + Touch Screen | ||
| PUMP SYSTEM | Rotary Vane Vacuum Pump | ||
| Holding Vacuum Pump | |||
| Roots Vacuum Pump | |||
| Diffusion Pump | |||
| SAFETY SYSTEM | Numerous safety interlocks to protect operators and equipment | ||
| COOLING | Water | ||
| POWER MAX. | Approx. 170KW | ||
| AVERAGE POWER CONSUMPTION | Approx. 80 KW, depending on actual operation | ||
Magnetron Sputtering Deposition
Thermal Evaporating Depostion
Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.
