PVD sputtering + Ion Plating give a combination of advantages like no other can:
1. Economically efficient, generating the thinnest, most uniform coating films;
2. A dry coating process at low temperature in a vacuum chamber;
3. Offers great versatility and can be used for the deposition of conductive or non-conductive materials on any type of substrates, like: metals, ceramics, plastic materials.
4. Multi-layered coating are simple to produce. 5. Fast deposition rates and high quality surface finishes.
The planar magnetron sputtering cathodic (cylindrical sputtering cathodic) introducing, makes the coating colors is more reflective, coating surface is much more smoother, no spot and needle holes.
High quality coating products satisfy the demand of high level's pursuing.
RTAC-SP Standard Specifications
|Model||Size(mm)||Number of Planetary Rods||Cathodic Arc Sources||Sputtering Cathodes||Ion Source||Bias Power Supply (kVA)|
|3||8||4 Planar||Linear Anode||1*36|
|48||8||4 Planar||Linear Anode||1*30, AE|
|RTAC1250-SP||1250xH1250||6,8,12,16||8||4~8 Cylinder||depends on coating process and product||1*36|
|RTAC1616-SP||1600xH1600||6*6||9||2 Cylinder or Planar||1*48|
TiN deposition videos on metal parts