Vacuum Flask Copper Magnetron Sputtering System / Vacuum Flask PVD Cooper Deposition
Magnetron Sputtering Technology which represents a real alternative to
definitively substitute Chrome/Silver/Gold electroplating coating onto metals/ceramics/
resin/plaster/glass and plastic materials which is considered to be a strong pollutant and a health hazard.
The most important is the added value brings to producers. The Sputtering PVD processes
enable almost unlimited production of coatings on any type of complex surface. Mostly, for
aesthetic (decorative), functional coating applications.
Vacuum Flask Copper Magnetron Sputtering System
RTSP1618 is designed and produced exclusively for vacuum flask cooper deposition. The depositing layer thickness is up to 2~3 microns which gives extremely good thermal heat preservation.
When add the cathodic arc sources, it can be used for vacuum flask exterior coating to generate various decorative colors: black, gold, blue, rainbow etc.
Vacuum Flask Copper Magnetron Sputtering Technology Advantages
1. It is totally economically efficient generating the thinnest and most uniform coating films;
2. It is a dry coating process at low temperature in a vacuum chamber;
3. It offers great versatility, can be used for the deposition of conductive or non-conductive materials on any type
of substrates, like: metals, ceramics, plastic materials.
4. Multi layers coating are available.
Vacuum Flask Copper Magnetron Sputtering System Coating targets:
Chrome , Nickel, Silver, Gold, Titanium targets are applied to generate the high quality thin films on
|MATERIAL||Stainless Steel (S304)|
|CHAMBER SIZE||Φ1600*1800mm (H)|
|PUMP SYSTEM||Rotary Piston Vacuum Pump|
|Rotary Vane Vacuum Pump|
|Roots Vacuum Pump|
|TECHNOLOGY||Magnetron Sputtering Coating+Glow discharging|
|CONTROL||PLC(Programmable Logic Controller) + Touch Screen|
|GAS||Gas Mass Flow Meters|
|SAFETY SYSTEM||Numerous safety interlocks to protect operators and equipment|
|AVERAGE POWER CONSUMPTION||70KW|