Copper Thin Film Coating Machine , Au Conductive Thin Film Sputtering Deposition Plant, Silver Sputtering Coating System
Copper Magnetron Sputtering Vacuum Coater
1) Film thickness controllability and well repeatability,can be a reliable system of pre-plated thickness of the films and sputtering in a larger surface of uniform film;
2) The adhesion of the film and the substrate is very well. Some of the high energy of sputtered atoms to produce different levels of injection phenomenon, pseudo-diffusion layer formed on the substrate layer of sputtered atoms and substrate atoms fused with each other;
3) Preparation of special material of the film, you can use different materials and sputtering hybrid film, compound film,also can be sputtered into the TiN imitation gold film.
Copper Magnetron Sputtering Vacuum Coater Specifications
Magnetron Sputtering Coating Machine | ||||||
Performance | RTSP-700 | RTSP-900 | RTSP-1000 | RTSP-1250 | RTSP-1400 | RTSP -1600 |
Size of coating chamber | 700*H900mm | 900*H1100mm | 1000*H1200mm | 1250*H1350mm | 1400*H1600mm | 1600*H1800mm |
Power supply type | Filament power supply, pulse bias power supply, DC magnetron power supply, intermediate frequency magnetron power supply, radio frequency magnetron power supply, linear ionization source | |||||
Structure of vacuum chamber | Vertical double door, vertical front door structure, rear air exhaust system | |||||
Material of vacuum chamber | High-quality stainless steel cavity | |||||
Limit vacuum | 6.0*10-4Pa | |||||
Pump-down time (no-load) | Pump the atmosphere to 8.0*10-3>Pa ≤15 minutes | |||||
Vacuum acquisition system | Diffusion pump or molecular pump + Roots pump + Mechanical pump + rotary vane pump (the specific model can be configured according to customer requirements) | |||||
Coating mode | Magnetron sputtering coating | |||||
Film type | Metal film, reactive film, compound film, multilayer film and semiconductor film | |||||
Magnetron target type | Rectangular magnetron target, cylindrical magnetron target and twin magnetron targets | |||||
Magnetron supply power and number of magnetron targets | Select according to different coating process and customer requirements | |||||
Bias power supply | 10KW/1 unit | 20KW/1 unit | 20KW/1 unit | 30KW/1 unit | 40KW/1 unit | 50KW/1unit |
Rotating mode of workpiece turntable | Planetary revolution and autorotation, variable frequency speed regulation (controllable and adjustable) | |||||
Process gas | 3-path or 4-path process gas flow control and display system, selective automatic gassing system | |||||
Cooling mode | Water circulation cooling mode, cooling water tower or industrial water cooler or deep cooling system. (Provided by customers) | |||||
Control mode | Manual/automatic integration mode, touch screen operation, PLC or computer control | |||||
Total power | 30KW | 35KW | 40KW | 50KW | 65KW | 80KW |
Alarm and protection | Alarm water shortage, overcurrent and over-voltage, open circuit and other abnormal conditions of pumps, targets and so on and execute relevant protective measures and electric interlock function | |||||
Equipment area | W2m*L3m | W2.5m*L3.5m | W3m*L4m | W4m*L5m | W4.5m*L6m | W5m*L7m |
Other technical parameters | Water Pressure ≥0.2MPa, Water Temperature ≤25°C, Air Pressure: 0.5-0.8MPa | |||||
Remarks | The specific configuration of coating equipment can be designed according to process requirements of coating products |
Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.