DPC Ceramic Innovative Custom PVD Machine PCB Copper Plating Machine DC Pulsed / MF Magnetron Sputtering
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DPC Ceramic Innovative Custom PVD Machine PCB Copper Plating Machine DC Pulsed / MF Magnetron Sputtering
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Features
Basic Infomation
Place of Origin: MADE IN CHINA
Brand Name: ROYAL
Certification: CE
Model Number: DPC1215+
High Light:

vacuum metallizing machine

,

copper plating machine

Payment & Shipping Terms
Packaging Details: Export standard, to be packed in new cases/cartons, suitable for long-distance ocean/air and inland transportation.
Delivery Time: 12 weeks
Payment Terms: L/C, T/T
Supply Ability: 10 sets per month
Specifications
Application: Ceramic PCB, AlN PCB, Al2O3 PCB, Electronics, LED Lighting
Coating Materials: Copper, Cr/Ti/Ni/Au/Ag/SS Etc.
PVD Technology: DC Pulsed / MF Magnetron Sputtering
Benefits: Large Capacity, Flexible Modules Design, Precised Manufacturing.
Product Description

DPC ceramic PCB / Alumina Oxide (Al2O3) PCB, Aluminium Nitride (AIN) PCB Copper Plating by PVD

 

 

The DPC process- Direct Plating Copper is an advanced coating technology applied with LED, semiconductor, electronic industries. One typical application is Ceramic Radiating Substrate. Cooper conductive film deposition on Aluminum Oxide (Al2O3), AlN substrates by PVD vacuum sputtering technology, compared with traditional manufacturing methods: DBC LTCC HTCC, much lower production cost is its high feature.


Royal technology team collaborated with our customer to developed the DPC process successfully with PVD sputtering technology.

 

 

Applications of DPC:
HBLED
Substrates for solar concentrator cells
Power semiconductor packaging including automotive motor control
Hybrid and electric automobile power management electronics
Packages for RF
Microwave devices

 

 

Technical Advantages:


The DPCS1215+ Sputtering system is upgraded version based on original ASC1215 model, the newest system has several advantages:

 

Higher Efficient Process:


1. Double sides coating is available by turnover fixture design;
2. Up to 8 standard planar cathode flanges for multiple source.
3. Large capacity up to 2.2 ㎡ Ceramic chips per cycle;
4. Fully Automation, PLC+Touch Screen, ONE-touch control system.

Lower Production Cost:
1. Equipped with 2 magnetic suspension molecular pump, fast starting time, free maintenance;
2. Maximum heating power;
3. Octagonal shape of chamber for optimum space using, up to 8 arc sources and 4 sputtering cathodes for fast deposition of coatings;

 

 

Performance

1. Ultimate Vacuum Pressure: better than 5.0×10-6 Torr.

2. Operating Vacuum Pressure: 1.0×10-4 Torr.

3. Pumpingdown Time: from 1 atm to 1.0×10-4 Torr≤ 3 minutes ( room temperature, dry, clean and empty chamber)

4. Metalizing material (sputtering + Arc evaporation): Ni, Cu, Ag, Au, Ti, Zr, Cr etc.

5. Operating Model: Full Automatically /Semi-Auto/ Manually

 

Description DPC1215+
Chamber Height (mm) 1500
Door width x height (mm) 1200 x 1200
Sputtering Cathodes Mounting Flange 4
Ion Source Mounting Flange 1
Arc Cathodes Mounting Flange 8
Satellites (mm) 16 x Φ120
Pulsed Bias Power (KW) 36
Sputtering Power (KW) DC36 + MF36
Arc Power(KW) 8 x 5
Ion Source Power (KW) 5
Heating Power (KW) 18
Effective Coating Height (mm) 1020
Magnetic Suspension Molecular Pump 2 x 3300 L/S
Roots Pump 1 x 1000m³/h
Rotary Vane Pump 1 x 300m³/h
Holding Pump

1 x 60m³/h

 

Capacity 2.2 ㎡

 

 

Layout 

DPC Ceramic Innovative Custom PVD Machine PCB Copper Plating Machine DC Pulsed / MF Magnetron Sputtering 0

DPC Ceramic Innovative Custom PVD Machine PCB Copper Plating Machine DC Pulsed / MF Magnetron Sputtering 1

 

 

 

3D Design Illustration

 

DPC Ceramic Innovative Custom PVD Machine PCB Copper Plating Machine DC Pulsed / MF Magnetron Sputtering 2

 

Either you are looking for a total coating solutions for Ceramic PBC   or the finished products, please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.

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Get in touch with us
Contact Person : Ms. ZHOU XIN
Fax : 86-21-67740022
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