Copper PVD Magnetron Sputtering Machine, Copper Conductive thin film deposition System
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Copper PVD Magnetron Sputtering Machine,  Copper Conductive thin film deposition System
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Features
Basic Infomation
Place of Origin: MADE IN CHINA
Brand Name: ROYAL
Certification: CE
Model Number: RTSP
High Light:

magnetron sputtering machine

,

vacuum deposition equipment

Payment & Shipping Terms
Packaging Details: Export standard, to be packed in new cases/cartons, suitable for long-distance ocean/air and inland transportation.
Delivery Time: 12 weeks
Payment Terms: L/C, D/A, D/P, T/T
Supply Ability: 10 sets per month
Specifications
Application: Electronic Industry, Other Industries Need Electric Magnetic Interference Shielding Function
Coating Materials: Copper And Stainless Steel, Aluminum, Chrome, Titanium Etc.
PVD Technology: Tungsten Filament Evaporation, DC Magnetron Sputtering
Equipment Name: PVD. Sputtering Coating Plant , PVD Vacuum Coating Machine, Vacuum Metallizion, Vacuum Metallizer, Vacuum Deposition, Vacuum Deposition, Thermal Vacuum Metallizer,
Product Description

Copper Vacuum Metallizing Equipment, Cu Copper PVD Thermal Evaporation Coater, Copper Sputtering Deposition System

 

 

RTEP1616-SPDC   PVD copper vacuum metallizing machine consist of  thermal evaporation and sputtering deposition sources, vacuum coating chamber , vacuum pumping system, deposition system, cooling system , electrical control system , workpiece rotating rack.  

 

Thermal Evaporation and Sputtering Metalizing Machine Features:


Dual chamber for independent loading operations.
Four types of coating process modes available for selection.
Option: RF generators or magnetron sputtering source can be installed for surface coating.
Uses planetary rotation mechanism to achieve good film uniformity on curved surface substrates.

 

Thermal Evaporation and Sputtering Metalizing Machine Application:

 

Plastic cutlery, Ceramic, Electronics product, Cellphone housing, NCVM applications, Decorative items, Metallic finish.
Coating Function:Protective coating, functional coating.
Film: Copper conductive film, Metal film, semi-transparent film, Mobile phone EMI, NCVM, Dielectric film.
Substrates:plastic parts, construction material, atrs&craft, electronics products etc

 

Model Size(mm) Substrate Jigs (Qty.) Evaporation Power(kVA Cathode (KW) Cycle Time

Electrical

Power

RTEP1212-SP 1200xH1200 6,8 20 DC30 10'~40' depends on Product 3Phase/AC380V,50HZ
RTEP1214-SP 1200xH1400 6, 8,16 20 AC36
RTEP1414-SP 1400xH1400 6,16 35 DC30
RTEP1416-SP 1400xH1600 8.16 35 DC35
RTEP1616-SP 1600xH1600 8.16 35 DC50
RTEP1618-SP 1600xH1800 8.16 35 DC50    

Copper PVD Magnetron Sputtering Machine,  Copper Conductive thin film deposition System 0

Copper PVD Magnetron Sputtering Machine,  Copper Conductive thin film deposition System 1

 

 

 

Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.

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Contact Person : Ms. ZHOU XIN
Fax : 86-21-67740022
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