Copper Vacuum Metallizing Equipment, Cu Copper PVD Thermal Evaporation Coater, Copper Sputtering Deposition System
RTEP1616-SPDC PVD copper vacuum metallizing machine consist of thermal evaporation and sputtering deposition sources, vacuum coating chamber , vacuum pumping system, deposition system, cooling system , electrical control system , workpiece rotating rack.
Thermal Evaporation and Sputtering Metalizing Machine Features:
Dual chamber for independent loading operations.
Four types of coating process modes available for selection.
Option: RF generators or magnetron sputtering source can be installed for surface coating.
Uses planetary rotation mechanism to achieve good film uniformity on curved surface substrates.
Thermal Evaporation and Sputtering Metalizing Machine Application:
Plastic cutlery, Ceramic, Electronics product, Cellphone housing, NCVM applications, Decorative items, Metallic finish.
Coating Function:Protective coating, functional coating.
Film: Copper conductive film, Metal film, semi-transparent film, Mobile phone EMI, NCVM, Dielectric film.
Substrates:plastic parts, construction material, atrs&craft, electronics products etc
| Model | Size(mm) | Substrate Jigs (Qty.) | Evaporation Power(kVA | Cathode (KW) | Cycle Time |
Electrical Power |
| RTEP1212-SP | 1200xH1200 | 6,8 | 20 | DC30 | 10'~40' depends on Product | 3Phase/AC380V,50HZ |
| RTEP1214-SP | 1200xH1400 | 6, 8,16 | 20 | AC36 | ||
| RTEP1414-SP | 1400xH1400 | 6,16 | 35 | DC30 | ||
| RTEP1416-SP | 1400xH1600 | 8.16 | 35 | DC35 | ||
| RTEP1616-SP | 1600xH1600 | 8.16 | 35 | DC50 | ||
| RTEP1618-SP | 1600xH1800 | 8.16 | 35 | DC50 |
Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.
