AlN Chips Copper Sputtering Depostion System, Aluminum Nitride Copper Direct Plating Machine
1 set
MOQ
negotiable
Price
AlN Chips Copper Sputtering Depostion System,  Aluminum Nitride Copper Direct Plating Machine
Features Gallery Product Description Request A Quote
Features
Basic Infomation
Place of Origin: Made in China
Brand Name: ROYAL
Certification: CE certification
Model Number: RTAS1215
High Light:

pvd coating system

,

titanium coating machine

Payment & Shipping Terms
Packaging Details: Export standard, to be packed in new cases/cartons, suitable for long-distance ocean/air and inland transportation.
Delivery Time: 12 weeks
Payment Terms: L/C, D/A, D/P, T/T
Supply Ability: 6 sets per month
Specifications
Deposition Sources: Magnetron DC / MF Sputtering + Steered Cathodic Arc
Deposition Films: Ni, Cu, Ag, Au, Ti, Zr, Cr Etc.
Applications: LED Ceramic Chips With Cooper Plating, Al2O3, AlN Ceramic Circuit Boards, Al2O3 Plates On LED, Semiconductor
Film Features: Wear Resistance, Strong Adhesion, Decorative Coating Colors
Product Description

AlN Chips Copper Sputtering Depostion System, Aluminum Nitride PVD Copper Sputtering Machine

 

Performance

1. Ultimate Vacuum Pressure: better than 5.0×10-6 Torr.

2. Operating Vacuum Pressure: 1.0×10-4 Torr.

3. Pumpingdown Time: from 1 atm to 1.0×10-4 Torr≤ 3 minutes ( room temperature, dry, clean and empty chamber)

4. Metalizing material (sputtering + Arc evaporation): Ni, Cu, Ag, Au, Ti, Zr, Cr etc.

5. Operating Model: Full Automatically /Semi-Auto/ Manually

 

Structure

The vacuum coating machine contains key completed system listed below:

1. Vacuum Chamber

2. Rouhging Vacuum Pumping System (Backing Pump Package)

3. High Vacuum Pumping System ( Magnetically Suspension Molecular Pump)

4. Electrical Control and Operation System

5. Auxiliarry Facility System (Sub System)

6. Deposition System

 

Copper Sputtering Coating Machine Key Features

 

1. Equipped with 8 steer arc cathodes and DC Sputtering Cathodes, MF Sputtering Cathodes, Ion source unit. 

2. Multilayer and co-deposition coating available

3. Ion source for plasma cleaning pre-treatment and Ion-beam assisted deposition to enhance the film adhesion. 

4. Ceramic/ Al2O3/AlN substrates heating up unit; 

5. Substrate rotation and revolution system, for 1-side coating and 2-sides coating. 

 

AlN Chips Copper Sputtering Depostion System,  Aluminum Nitride Copper Direct Plating Machine 0

 

 

 

Cooper Magnetron Sputtering Coating Plant on Ceramic Radiating Substrate  

 

The DPC process- Direct Plating Copper is an advanced coating technology applied with LED / semiconductor / electronic industries. One typical application is Ceramic Radiating Substrate. 

Cooper conductive film deposition on Al2O3, AlN substrates by PVD vacuum sputtering technology,  compared with traditional manufacturing methods:  DBC  LTCC  HTCC, much lower production cost is its high feature. 

Royal technology team assited our customer to developed the DPC process sucessfully with PVD sputtering technology. 

The RTAC1215-SP machine designed exclusively for Copper conductive film coating on Ceramic chips, ceramic circuit board. 

 

 

AlN Chips Copper Sputtering Depostion System,  Aluminum Nitride Copper Direct Plating Machine 1

 

 

Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.

 

 
Recommended Products
Get in touch with us
Contact Person : Ms. ZHOU XIN
Fax : 86-21-67740022
Characters Remaining(20/3000)