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Place of Origin: | Made in China |
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Brand Name: | ROYAL |
Certification: | CE |
Model Number: | RTEP1616-SP |
Minimum Order Quantity: | 1 set |
Price: | negotiable |
Packaging Details: | Export standard, to be packed in new cases/cartons, suitable for long-distance ocean/air and inland transportation. |
Delivery Time: | 8~12 weeks |
Payment Terms: | L/C, T/T, D/A, D/P |
Supply Ability: | 10 sets per month |
Chamber: | Vertical Orientation, 2-doors | Deposition Source: | Thermal Filament Evaporation + Sputtering Metalization |
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Deposition Materials: | Copper, Stainless Steel | Applications: | Plastic And Metal Cutlery, Ceramic, Electronics Product, Cellphone Housing, NCVM Applications, Decorative Items, Metallic Finish. |
Chamber Inner Size: | Dia1600 * H1600mm | ||
High Light: | vacuum metalizing equipment,vacuum metallization equipment |
Vertical Vacuum Coating Machine, EMI Shielding Films MetallizationSystem, SS sputtering depostion, Copper evaporation
PVD EMI shileding Coatings: Metal film, semi-transparent film, Mobile phone EMI, NCVM, Dielectric film.
PVD EMI shileding Coating Material: Cu, Silver, Stainless Steel, Ni, Cr etc.
EMI shileding surface treatment has been applied with cell phone industry for years. Our customers are:
Sumgsung, Iphone, Lenovo, Huawei phones manufactures.
EMI shielding vacuum coater:
PVD EMI shileding Coating Benefits:
1) Process is environmentally friendly
2) Low investment and high payback for owner;
3) High volume production, fast cycle, low cost;
4) Unique design is friendly operation and low maintenance.
EMI Shielding Film Coating Properties
Film thickness : 1.5 ~ 3 microns depends on the requirement.
Film resistance: (ohm) better than 0.5Ω
Adhesion: 3M810 tape > 5B
PVD EMI shileding Coating Specifications
MODEL | RTEP1616-SP | ||||||
TECHNOLOGY |
THERMAL EVAPORATION, TUNGSTEN ,FILAMENT, glow discharge, magnetron sputtering |
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MATERIAL | Stainless Steel (S304) | ||||||
CHAMBER SIZE | Φ1600*1600mm (H) | ||||||
CHAMBER TYPE | Cylinder, vertical, 2-doors | ||||||
EVAPORTATION SYSTEM | EXCLUSIVE DESIGN FOR EMI metallization | ||||||
DEPOSITION MATERIAL | Silver, Copper, Stainless Steel, Nickel | ||||||
DEPOSITION SOURCE | TUNGSTEN FILAMENT + DC Sputtering Cathode | ||||||
CONTROL | PLC(Programmable Logic Controller) + Touch Screen | ||||||
PUMP SYSTEM | Rotary Pistonr Vacuum Pump | ||||||
Rotary Vane Vacuum Pump | |||||||
Roots Vacuum Pump | |||||||
Diffussion Pump + Brooks Polycold | |||||||
PRE-TREATMENT | Plasma Cleaning | ||||||
SAFETY SYSTEM | Numerous safety interlocks to protect operators and equipment | ||||||
COOLING | Cold Water | ||||||
POWER ELECTRICAL | 480V/3 phases/60HZ ( USA compliant) | ||||||
460V/3 phases/50HZ ( Asia compliant) | |||||||
380V/3 phases/50HZ ( EU-CE compliant) | |||||||
FOOTPRINT | L9000*W4200*H3000mm | ||||||
TOTAL WEIGHT | 10.5 T | ||||||
CYCLE TIME |
20 minutes (depending on substrate material, substrate geometry and environmental conditions) |
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POWER MAX.. | 80KW | ||||||
AVERAGE POWER CONSUMPTION (APPROX.) | 45KW |
Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.