Phone Accessories EMI Shielding Films Metallization/ PVD EMI shileding Coatings on Mobile Phone
How Does PVD Coating Work?
The solid metal is vaporized or ionized in a high vacuum environment and deposited on electrically conductive materials as a pure metal or metal alloy films. When a reactive gas, such as nitrogen, oxygen or a hydrocarbon-based gas is introduced to the metallic vapor, it creates nitride, oxide, or carbide coatings as the metallic vapor stream, chemically reacts with the gasses. PVD coating must be done in a specialized reaction chamber so that the vaporized material doesn’t react with any contaminants that would otherwise be present in the room.
During the process of PVD coating, the process parameters are closely monitored and controlled so that the resulting film hardness, adhesion, chemical resistance, film structure, and other properties are repeatable for each run. Various PVD coating are used to increase wear resistance, reduce friction, improve appearance, and achieve other performance enhancements.
In order to deposit high purity materials such as titanium, chromium, or zirconium, silver, gold, aluminum, copper, stainless steel, the physical process of PVD coating utilizes one of several different PVD coating methods, including:
DC/MF sputtering(the bombardment of ions)
Ion Beam Deposition
Each of these methods belong in the overarching category of “physical vapor deposition”.
EMI shielding vacuum coater:
PVD EMI shileding Coating Benefits:
1) Process is environmentally friendly
2) Low investment and high payback for owner;
3) High volume production, fast cycle, low cost;
4) Unique design is friendly operation and low maintenance.
What is PVD coating?
PVD coating, or Physical Vapor Deposition coating, defines a variety of vacuum coating methods. These coating techniques are used to apply an extremely thin film to objects that require protective barriers, decorative colors, or various other functional benefits. It is a typeof vavuum deposition process where a material is vaporized in a vacuum chamber, transported atom by atom across the chamber to the substrate, and condensed into a film at the substrate’s surface.
EMI Shielding Film Coating Properties
Film thickness : 1.5 ~ 3 microns depends on the requirement.
Film resistance: (ohm) better than 0.5Ω
Adhesion: 3M810 tape > 5B
PVD EMI shileding Coating Specifications
THERMAL EVAPORATION, TUNGSTEN ,FILAMENT, glow discharge, magnetron
|MATERIAL||Stainless Steel (S304)|
|CHAMBER SIZE||Φ1600*1600mm (H)|
|CHAMBER TYPE||Cylinder, vertical, 2-doors|
|EVAPORTATION SYSTEM||EXCLUSIVE DESIGN FOR EMI metallization|
|DEPOSITION MATERIAL||Silver, Copper, Stainless Steel, Nickel|
|DEPOSITION SOURCE||TUNGSTEN FILAMENT + DC Sputtering Cathode|
|CONTROL||PLC(Programmable Logic Controller) + Touch Screen|
|PUMP SYSTEM||Rotary Pistonr Vacuum Pump|
|Rotary Vane Vacuum Pump|
|Roots Vacuum Pump|
|Diffussion Pump + Brooks Polycold|
|SAFETY SYSTEM||Numerous safety interlocks to protect operators and equipment|
|POWER ELECTRICAL||480V/3 phases/60HZ ( USA compliant)|
|460V/3 phases/50HZ ( Asia compliant)|
|380V/3 phases/50HZ ( EU-CE compliant)|
|TOTAL WEIGHT||10.5 T|
20 minutes (depending on substrate material, substrate geometry and
|AVERAGE POWER CONSUMPTION (APPROX.)||45KW
Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.