DPC Direct Copper Plating on Ceramics, Al2O3 / AlN Circuit Boards Copper Deposition Machine
1 set
MOQ
negotiable
Price
DPC Direct Copper Plating on Ceramics,  Al2O3 / AlN Circuit Boards Copper Deposition Machine
Features Gallery Product Description Request A Quote
Features
Basic Infomation
Place of Origin: Made in China
Brand Name: ROYAL
Certification: CE
Model Number: RTAS1200
High Light:

pvd coating system

,

titanium coating machine

Payment & Shipping Terms
Packaging Details: Export standard, to be packed in new cases/cartons, suitable for long-distance ocean/air and inland transportation.
Delivery Time: 12 weeks
Payment Terms: L/C, D/A, D/P, T/T
Supply Ability: 6 sets per month
Specifications
Deposition Sources: Magnetron DC / MF Sputtering + Steered Cathodic Arc
Deposition Films: Ni, Cu, Ag, Au, Ti, Zr, Cr Etc.
Applications: LED Ceramic Chips With Cooper Plating, Al2O3, AlN Ceramic Circuit Boards, Al2O3 Plates On LED, Semiconductor
Film Features: Wear Resistance, Strong Adhesion, Decorative Coating Colors
Product Description

 

 

Brightness Lighting DPC Ceramic jewelry ring Vacuum Coating , Al2O3 / AlN Circuit Boards PVD Copper Plating

 

Performance

1. Ultimate Vacuum Pressure: better than 5.0×10-6 Torr.

2. Operating Vacuum Pressure: 1.0×10-4 Torr.

3. Pumpingdown Time: from 1 atm to 1.0×10-4 Torr≤ 3 minutes ( room temperature, dry, clean and empty chamber)

4. Metalizing material (sputtering + Arc evaporation): Ni, Cu, Ag, Au, Ti, Zr, Cr etc.

5. Operating Model: Full Automatically /Semi-Auto/ Manually

 

Structure

The vacuum coating machine contains key completed system listed below:

1. Vacuum Chamber

2. Rouhging Vacuum Pumping System (Backing Pump Package)

3. High Vacuum Pumping System ( Magnetically Suspension Molecular Pump)

4. Electrical Control and Operation System

5. Auxiliarry Facility System (Sub System)

6. Deposition System

 

Copper Sputtering Coating Machine Key Features

 

1. Equipped with 8 steer arc cathodes and DC Sputtering Cathodes, MF Sputtering Cathodes, Ion source unit. 

2. Multilayer and co-deposition coating available

3. Ion source for plasma cleaning pre-treatment and Ion-beam assisted deposition to enhance the film adhesion. 

4. Ceramic/ Al2O3/AlN substrates heating up unit; 

5. Substrate rotation and revolution system, for 1-side coating and 2-sides coating. 

 

DPC Direct Copper Plating on Ceramics,  Al2O3 / AlN Circuit Boards Copper Deposition Machine 0

 

 

 

Cooper Magnetron Sputtering Coating Plant on Ceramic Radiating Substrate  

 

The DPC process- Direct Plating Copper is an advanced coating technology applied with LED / semiconductor / electronic industries. One typical application is Ceramic Radiating Substrate. 

Cooper conductive film deposition on Al2O3, AlN substrates by PVD vacuum sputtering technology,  compared with traditional manufacturing methods:  DBC  LTCC  HTCC, much lower production cost is its high feature. 

Royal technology team assited our customer to developed the DPC process sucessfully with PVD sputtering technology. 

The RTAC1215-SP machine designed exclusively for Copper conductive film coating on Ceramic chips, ceramic circuit board. 

 

 

DPC Direct Copper Plating on Ceramics,  Al2O3 / AlN Circuit Boards Copper Deposition Machine 1

 

 

 

How Does PVD Coating Work?

 

The solid metal is vaporized or ionized in a high vacuum environment and deposited on electrically conductive materials as a pure metal or metal alloy films. When a reactive gas, such as nitrogen, oxygen or a hydrocarbon-based gas is introduced to the metallic vapor, it creates nitride, oxide, or carbide coatings as the metallic vapor stream, chemically reacts with the gasses. PVD coating must be done in a specialized reaction chamber so that the vaporized material doesn’t react with any contaminants that would otherwise be present in the room.

During the process of PVD coating, the process parameters are closely monitored and controlled so that the resulting film hardness, adhesion, chemical resistance, film structure, and other properties are repeatable for each run. Various PVD coating are used to increase wear resistance, reduce friction, improve appearance, and achieve other performance enhancements.

In order to deposit high purity materials such as titanium, chromium, or zirconium, silver, gold, aluminum, copper, stainless steel, the physical process of PVD coating utilizes one of several different PVD coating methods, including:

Arc evaporation

Thermal evaporation

DC/MF sputtering(the bombardment of ions)

Ion Beam Deposition

Ion plating

Enhanced sputtering

Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.

 

 
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Contact Person : Ms. ZHOU XIN
Fax : 86-21-67740022
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