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PVD Nickle and Copper Sputtering Thin Film Coating Machine, Au Gold Conductive Film Deposition

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PVD Nickle and Copper Sputtering Thin Film Coating Machine, Au Gold  Conductive Film Deposition
Features Gallery Product Description Request A Quote
Technology: DC Magnetron Sputtering, PVD Sputtering Deposition, PVD Vacuum Coating
Applications: Conductive Film Deposition, Corrosion Resistance Film Coating
Properties: Robust And High Volume Design Machine
Sputtering Targets: Ni, Cr, Cu, Au, Ag, Ta, Ti, SS, Al Etc. Pure Metals
Factory Location: Shanghai City, China
Worldwide Service: Poland - Europe; Iran- West Asia & Middle East, Turkey, India, Mexico- South America
Training Service: Machine Operation, Maintenance, Coating Process Recipes, Program
Warranty: Limited Warranty 1 Year For Free, Whole Life For Machine
OEM & ODM: Available, We Support Tailor Made Design And Fabrication
High Light:

thin film coating equipment


dlc coating equipment

Basic Infomation
Place of Origin: China
Brand Name: ROYAL
Certification: CE
Model Number: RTAS
Payment & Shipping Terms
Packaging Details: Export standard, to be packed in new cases/cartons, suitable for long-distance ocean/air and inland transportation.
Delivery Time: 10 to 12 weeks
Payment Terms: L/C, T/T
Supply Ability: 10 sets per month
Product Description

              Circuit Board Conductive Thin Film Deposition by PVD DC Sputtering Process, Copper plating, Au Sputteringdeposition



                                                           ------Large Capacity, Flexible Modules Design, Precised Manufacturing.


Technical Advantages:

The DPC-RTAS1215+ Sputtering system is the upgraded version of the original ASC1215 model, the newest system has several advantages:


Higher Efficient Process:
1. Double sided coating is available by turnover fixture design
2. Up to 8 standard planar cathode flanges for multiple sources
3. Large capacity up to 2.2 ㎡ ceramic chips per cycle
4. Fully Automation, PLC+Touch Screen, ONE-touch control system


Lower Production Cost:
1. Equipped with 2 magnetic suspension molecular pumps, fast starting time, free maintenance;
2. Maximum heating power;
3. Octagonal shape of chamber for optimum space using, up to 8 arc sources and 4 sputtering cathodes for fast deposition of coatings




The DPC process- Direct Plating Copper is an advanced coating technology applied with LED and semiconductors in electronic industries. One typical application is Ceramic Radiating Substrate. Copper conductive film deposition on Aluminum Oxide (Al2O3), AlN substrates by PVD vacuum sputtering technology, has above all one big advantage compared to traditional manufacturing methods: DBC LTCC HTCC have much lower production costs.

Royal Technology’s team collaborated with our customer to develop the DPC process successfully applying PVD sputtering technology.


Applications of DPC:
Substrates for solar concentrator cells
Power semiconductor packaging including automotive motor control
Hybrid and electric automobile power management electronics
Packages for RF
Microwave devices


Technical Specifications


Description DPC-RTAS1215+
Chamber Height (mm) 1500
Chamber diameter (mm) φ1200
Sputtering Cathodes Mounting Flange 4
Ion Source Mounting Flange 1
Arc Cathodes Mounting Flange 8
Satellites (mm) 16 x Φ150
Pulsed Bias Power (KW) 36
Sputtering Power (KW) DC36 + MF36
Arc Power(KW) 8 x 5
Ion Source Power (KW) 5
Heating Power (KW) 36
Effective Coating Height (mm) 1020
Magnetic Suspension Molecular Pump 2 x 3300 L/S
Roots Pump 1 x 1000m³/h
Rotary Vane Pump 1 x 300m³/h
Holding Pump 1 x 60m³/h
Capacity 2.2
Installation Area ( L x W x H) mm 4200*6000*3500




HMI + Touch Screen Operation System


PVD Nickle and Copper Sputtering Thin Film Coating Machine, Au Gold  Conductive Film Deposition 0



Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.



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