May 8, 2018
The DPC process- Direct Plating Copper is an advanced coating technology applied with LED / semiconductor / electronic industries. One typical application is Ceramic Radiating Substrate. Cooper conductive film deposition on Aluminum Oxide (Al2O3), AlN substrates by PVD vacuum sputtering technology, compared with traditional manufacturing
methods: DBC LTCC HTCC, much lower production cost is its high feature.
Royal technology team assisted our customer to developed the DPC process successfully with PVD sputtering technology.
Keywords: Ceramic sealing parts, DPC process, Copper PVD Sputtering system, LED Ceramic Chips With Cooper Plating, Al2O3, AlN Ceramic Circuit Boards, Al2O3 Plates On LED, Semiconductor
Applications of DPC:
· Substrates for solar concentrator cells
· Power semiconductor packaging including automotive motor control
· Hybrid and electric automobile power management electronics
· Packages for RF
· Microwave devices
DPC Technology Performance
Various substrate materials: Ceramic (Al3O2, AlN), Glass, and Si
|Contact Person :||Ms. ZHOU XIN|